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參數(shù)資料
| 型號(hào)： | TMP91FY12AF |
| 廠商： | Toshiba Corporation |
| 元件分類： | 微控制器 |
| 英文描述： | Quality And Reliability Assurance / Handling Precautions |
| 中文描述： | 質(zhì)量與可靠性保證/操作注意事項(xiàng) |
| 文件頁數(shù)： | 37/48頁 |
| 文件大小： | 390K |
| 代理商： | TMP91FY12AF |
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Quality and Reliability Assurance / Handling Precautions
030901
QUA-37
2002-02-20
4.3.7 Load Capacitance
Some devices display increased delay times if the load capacitance is large. Also,
large charging and discharging currents will flow in the device, causing noise.
Furthermore, since outputs are shorted for a relatively long time, wiring can
become fused.
Consult the technical information for the device being used to determine the
recommended load capacitance.
4.3.8 Thermal Design
The failure rate of semiconductor devices is greatly increased as operating
temperatures increase. As shown in Figure 4.2, the internal thermal stress on a
device is the sum of the ambient temperature and the temperature rise due to
power dissipation in the device. Therefore, to achieve optimum reliability, observe
the following precautions concerning thermal design:
(1)
(2)
Keep the ambient temperature (Ta) as low as possible.
If the device’s dynamic power dissipation is relatively large, select the
most appropriate circuit board material, and consider the use of heat
sinks or of forced air cooling. Such measures will help lower the thermal
resistance of the package.
Derate the device’s absolute maximum ratings to minimize thermal stress
from power dissipation.
θ
ja =
θ
jc +
θ
ca
θ
ja = (Tj – Ta)/P
θ
jc = (Tj – Tc)/P
θ
ca = (Tc – Ta)/P
in which
θ
ja = thermal resistance between junction and surrounding air (°C/W)
θ
jc = thermal resistance between junction and package surface, or
internal thermal resistance (°C/W)
θ
ca= thermal resistance between package surface and
surrounding air, or external thermal resistance (°C/W)
Tj = junction temperature or chip temperature (°C)
Tc = package surface temperature or case temperature (°C)
Ta = ambient temperature (°C)
P
= power dissipation (W)
(3)
Tc
θ
ca
Ta
Tj
θ
jc
Figure 4.2 Thermal Resistance of Package
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| TMP91FY22F | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Quality And Reliability Assurance / Handling Precautions |
| TMP91FY22FG | 功能描述:IC MCU FLASH 16BIT 256K 100QFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:TLCS-900/L1 標(biāo)準(zhǔn)包裝:330 系列:- 核心處理器:- 芯體尺寸:8/16-位 速度:40MHz 連通性:UART/USART 外圍設(shè)備:DMA，PWM，WDT 輸入/輸出數(shù):32 程序存儲(chǔ)器容量:- 程序存儲(chǔ)器類型:外部程序存儲(chǔ)器 EEPROM 大小:- RAM 容量:- 電壓 - 電源 (Vcc/Vdd):4.5 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:100-BQFP 包裝:管件 |
| TMP91FY28 | 制造商:TOSHIBA 制造商全稱:Toshiba Semiconductor 功能描述:Original CMOS 16-Bit Microcontroller |
| TMP91FY42FG | 制造商:Toshiba America Electronic Components 功能描述:IC 16BIT MCU 256K FLASH 120K RAM |
| TMP91FY42FG(C,JZ) | 制造商:Toshiba America Electronic Components 功能描述:MCU 16BIT 256KB FLASH 100-LQFP |
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