參數(shù)資料
型號(hào): STPCE1HEBI
廠商: 意法半導(dǎo)體
英文描述: X86 Core General Purpose PC Compatible System - on - Chip
中文描述: x86內(nèi)核兼容的通用計(jì)算機(jī)系統(tǒng)-關(guān)于-芯片
文件頁數(shù): 80/87頁
文件大?。?/td> 1356K
代理商: STPCE1HEBI
DESIGN GUIDELINES
80/87
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
Release 1.3 - January 29, 2002
As the PCB acts as a heat sink, the layout of top
and ground layers must be done with care to
maximize the board surface dissipating the heat.
The only limitation is the risk of losing routing
channels.
Figure 6-29
and
Figure 6-30
show a
routing with a good thermal dissipation thanks to
an optimized placement of power and signal vias.
The ground plane should be on bottom layer for
the best heat spreading (thicker layer than internal
ones) and dissipation (direct contact with air). .
Figure 6-29. Layout for Good Thermal Dissipation - top layer
1
A
3.3V ball
2.5V ball (Core / PLLs)
Via
Not Connected ball
STPC ball
GND ball
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