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參數(shù)資料
| 型號(hào)： | STPCE1HEBI |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | X86 Core General Purpose PC Compatible System - on - Chip |
| 中文描述： | x86內(nèi)核兼容的通用計(jì)算機(jī)系統(tǒng)-關(guān)于-芯片 |
| 文件頁(yè)數(shù)： | 58/87頁(yè) |
| 文件大?。?/td> | 1356K |
| 代理商： | STPCE1HEBI |
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MECHANICAL DATA
58/87
Release 1.3 - January 29, 2002
5.3. SOLDERING RECOMMENDATIONS
High quality, low defect soldering requires
identifying the
optimum temperature profile
for
reflowing the solder paste, therefore optimizing
the process. The heating and cooling rise rates
must be compatible with the solder paste and
components. A typical profile consists of a
preheat, dryout, reflow and cooling sections.
The most critical parameter in the
preheat
section
is to minimize the rate of temperature rise
to less than
2°
C / second, in order to minimize
thermal
shock
on
components.
the
semi-conductor
Dryout section
is used primarily to ensure that
the solder paste is fully dried before hitting reflow
temperatures.
Solder reflow is accomplished in the
reflow zone
,
where the solder paste is elevated to a
temperature greater than the melting point of the
solder. Melting temperature must be exceeded by
approximately 20
°
C to ensure quality reflow.
In reality the profile is not a line, but rather
a range
of temperatures
all solder joints must be
exposed. The total temperature deviation from
component thermal mismatch, oven loading and
oven uniformity must be within the band.
Figure 5-7. Reflow soldering temperature range
Temperature (
°
C )
Time ( s )
PREHEAT
DRYOUT
REFLOW
COOLING
240
0
250
200
150
100
50
0
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| STPCE1HDBC | X86 Core General Purpose PC Compatible System - on - Chip |
| STPCE1HDBI | X86 Core General Purpose PC Compatible System - on - Chip |
| STPR1610CT | Ultra Fast Recovery Rectifier Diodes(超快速恢復(fù)整流二極管) |
| STPR1620CT | Ultra Fast Recovery Rectifier Diodes(超快速恢復(fù)整流二極管) |
| STPR2410CT | Ultra Fast Recovery Rectifier Diodes(超快速恢復(fù)整流二極管) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPCELITE | 制造商:STMICROELECTRONICS 制造商全稱(chēng):STMicroelectronics 功能描述:X86 Core General Purpose PC Compatible System - on - Chip |
| STPCH0.5MBBL | 制造商:Panduit Corp 功能描述:TX5E SHIELDED PATCH CORD 制造商:Panduit Corp 功能描述:COPPER PATCH CORD, CAT 5E, INTL GRAY F/U |
| STPCH0.5MBBU | 制造商:Panduit Corp 功能描述:TX5E SHIELDED PATCH CORD 制造商:Panduit Corp 功能描述:COPPER PATCH CORD, CAT 5E, INTL GRAY F/U |
| STPCH0.5MBGR | 制造商:Panduit Corp 功能描述:TX5E SHIELDED PATCH CORD 制造商:Panduit Corp 功能描述:COPPER PATCH CORD, CAT 5E, INTL GRAY F/U |
| STPCH0.5MBRD | 制造商:Panduit Corp 功能描述:TX5E SHIELDED PATCH CORD 制造商:Panduit Corp 功能描述:COPPER PATCH CORD, CAT 5E, INTL GRAY F/U |
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