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  • 參數(shù)資料
    型號(hào): STPCC0310BTC3
    廠商: STMICROELECTRONICS
    元件分類(lèi): 外設(shè)及接口
    英文描述: MULTIFUNCTION PERIPHERAL, PBGA388
    封裝: PLASTIC, BGA-388
    文件頁(yè)數(shù): 40/51頁(yè)
    文件大?。?/td> 836K
    代理商: STPCC0310BTC3
    BOARD LAYOUT
    45/51
    Release B
    This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
    When using DIMM modules, schematics have to
    be done carefully in order to avoid data busses
    completely crossed on the board. This has to be
    checked at the library level. In order to achive lay-
    out shown in Figure 6-12, schematics have to im-
    plement the crossing described on Figure 6-13.
    The DQM signals must be exchanged using the
    same order.
    Figure 6-11. Clock routing
    MCLKO
    DIMMCKn input
    STPCMCLKI
    DIMMCKn input
    Low skewclock driver:
    L
    L+75mm*
    20pF
    * No additionnal 75mm when SDRAM directly soldered on board
    Figure 6-12. Optimum data bus layout for DIMM
    Figure 6-13. Schematics for optimum data bus layout for DIMM
    DIMM
    STPC
    SDRAMI/F
    D[15:00]
    D[31:16]
    D[47:32]
    D[63:48]
    MD[31:00]
    MD[63:32]
    MD[15:00],DQM[1:0]
    MD[31:16],DQM[3:2]
    MD[47:32],DQM[5:4]
    MD[63:48],DQM[7:6]
    D[15:00],DQM[1:0]
    D[31:16],DQM[3:2]
    D[47:32],DQM[5:4]
    D[63:48],DQM[7:6]
    DIMM
    STPC
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