參數(shù)資料
型號(hào): STPCC0310BTC3
廠商: STMICROELECTRONICS
元件分類: 外設(shè)及接口
英文描述: MULTIFUNCTION PERIPHERAL, PBGA388
封裝: PLASTIC, BGA-388
文件頁數(shù): 30/51頁
文件大小: 836K
代理商: STPCC0310BTC3
MECHANICAL DATA
36/51
Release B
5.2 388-PIN PACKAGE THERMAL DATA
388-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
Structure in shown in Figure 5-4.
Thermal dissipation options are illustrated in Fig-
ure 5-5 and Figure 5-6.
Figure 5-4. 388-Pin PBGA structure
Thermal balls
Power & Ground layers
Signal layers
Figure 5-5. Thermal dissipation without heatsink
Ambient
Board
Case
Junction
Board
Ambient
Case
Junction
Board
Rca
Rjc
Rjb
Rba
66
125
8.5
Rja = 13
°C/W
Airflow = 0
Board dimensions:
The PBGA is centered on board
Copper thickness:
-17
m for internal layers
-34
m for external layers
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Board temperature taken at the center balls
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