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參數(shù)資料
| 型號(hào)： | STPCC0310BTC3 |
| 廠商： | STMICROELECTRONICS |
| 元件分類(lèi)： | 外設(shè)及接口 |
| 英文描述： | MULTIFUNCTION PERIPHERAL, PBGA388 |
| 封裝： | PLASTIC, BGA-388 |
| 文件頁(yè)數(shù)： | 36/51頁(yè) |
| 文件大?。?/td> | 836K |
| 代理商： | STPCC0310BTC3 |
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BOARD LAYOUT
41/51
Release B
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
A local ground plane on opposite side of the board
as shown in Figure 6-6 improves thermal dissipa-
tion. It is used to connect decoupling capacitances
but can also be used for connection to a heat sink
or to the system’s metal box for better dissipation.
This possibility of using the whole system’s box for
thermal dissipation is very usefull in case of high
temperature inside the system and low tempera-
ture outside. In that case, both sides of the PBGA
should be thermally connected to the metal chas-
sis in order to propagate the heat flow through the
metal. Figure 6-7 illustrates such implementation.
Figure 6-6. Bottom side layout and decoupling
Ground plane for thermal dissipation
Via to ground layer
Figure 6-7. Use of metal plate for thermal dissipation
Metal planes
Thermal conductor
Board
Die
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