參數(shù)資料
型號: SSTUA32864EG
廠商: NXP Semiconductors N.V.
元件分類: 基準電壓源/電流源
英文描述: Linear Voltage Regulator IC; Package/Case:8-MSOP; Current Rating:250mA; Leaded Process Compatible:No; Output Voltage Max:2.8V; Peak Reflow Compatible (260 C):No; Reel Quantity:2500; Voltage Regulator Type:Low Dropout (LDO)
中文描述: 1.8伏配置的注冊緩沖的DDR2 - 667 RDIMM特別應用
文件頁數(shù): 19/19頁
文件大?。?/td> 112K
代理商: SSTUA32864EG
Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 12 May 2005
Document number: 9397 750 14757
Published in The Netherlands
Philips Semiconductors
SSTUA32864
1.8 V configurable registered buffer for DDR2-667 RDIMM applications
21. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
8
9
10
11
11.1
11.2
12
13
13.1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 7
Function table. . . . . . . . . . . . . . . . . . . . . . . . . . 7
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
Recommended operating conditions. . . . . . . . 8
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Test information. . . . . . . . . . . . . . . . . . . . . . . . 11
Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Output slew rate measurement. . . . . . . . . . . . 13
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 15
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 15
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16
Package related soldering information . . . . . . 16
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Contact information . . . . . . . . . . . . . . . . . . . . 18
13.2
13.3
13.4
13.5
14
15
16
17
18
19
20
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