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參數(shù)資料
| 型號： | SSTUA32864EG |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 基準電壓源/電流源 |
| 英文描述： | Linear Voltage Regulator IC; Package/Case:8-MSOP; Current Rating:250mA; Leaded Process Compatible:No; Output Voltage Max:2.8V; Peak Reflow Compatible (260 C):No; Reel Quantity:2500; Voltage Regulator Type:Low Dropout (LDO) |
| 中文描述： | 1.8伏配置的注冊緩沖的DDR2 - 667 RDIMM特別應(yīng)用 |
| 文件頁數(shù)： | 17/19頁 |
| 文件大?。?/td> | 112K |
| 代理商： | SSTUA32864EG |
9397 750 14757
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 12 May 2005
17 of 19
Philips Semiconductors
SSTUA32864
1.8 V configurable registered buffer for DDR2-667 RDIMM applications
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
14. Abbreviations
15. Revision history
Table 11:
Acronym
CMOS
DDR
DIMM
LVCMOS
PRR
RDIMM
SSTL
Abbreviations
Description
Complementary Metal Oxide Silicon
Double Data Rate
Dual In-line Memory Module
Low Voltage Complementary Metal Oxide Silicon
Pulse Repetition Rate
Registered Dual In-line Memory Module
Stub Series Terminated Logic
Table 12:
Document ID
SSTUA32864_1
Revision history
Release date
20050512
Data sheet status
Product data sheet
Change notice
-
Doc. number
9397 750 14757
Supersedes
-
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SSTUA32866 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-667 RDIMM applications |
| SSTUA32866BHLF | 功能描述:IC REGIST BUFFER 25BIT DDR 96BGA RoHS:是 類別:集成電路 (IC) >> 邏輯 - 專用邏輯 系列:- 產(chǎn)品變化通告:Product Discontinuation 25/Apr/2012 標準包裝:1,500 系列:74SSTV 邏輯類型:DDR 的寄存緩沖器 電源電壓:2.3 V ~ 2.7 V 位數(shù):14 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:48-TFSOP（0.240"，6.10mm 寬） 供應(yīng)商設(shè)備封裝:48-TSSOP 包裝:帶卷 (TR) |
| SSTUA32866BHLFT | 功能描述:IC REGIST BUFFER 25BIT DDR 96BGA RoHS:是 類別:集成電路 (IC) >> 邏輯 - 專用邏輯 系列:- 產(chǎn)品變化通告:Product Discontinuation 25/Apr/2012 標準包裝:1,500 系列:74SSTV 邏輯類型:DDR 的寄存緩沖器 電源電壓:2.3 V ~ 2.7 V 位數(shù):14 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:48-TFSOP（0.240"，6.10mm 寬） 供應(yīng)商設(shè)備封裝:48-TSSOP 包裝:帶卷 (TR) |
| SSTUA32866BHMLF | 制造商:Integrated Device Technology Inc 功能描述:REGISTERED BFFR SGL 25-CH CMOS 96TFBGA - Bulk |
| SSTUA32866EC | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-667 RDIMM applications |
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