參數(shù)資料
型號(hào)： SC16C752BIB48
廠商： NXP Semiconductors N.V.
元件分類(lèi)： 收發(fā)器
英文描述： 5 V, 2.2 V and 2.5 V dual UART, 5 Mbit-s (max.), with 64-byte FIFOs
封裝： SC16C752BIB48<SOT313-2 (LQFP48)|<<http://www.nxp.com/packages/SOT313-2.html<1<Always Pb-free,;SC16C752BIB48<SOT313-2 (LQFP48)|<<http://www.nxp.com/packages/SOT313-2.html&
文件頁(yè)數(shù)： 43/47頁(yè)
文件大小： 945K
代理商： SC16C752BIB48
SC16C752B
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 6 — 30 November 2010
43 of 47
NXP Semiconductors
SC16C752B
5 V, 2.2 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 25
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 27
and
28
Table 27.
Package thickness (mm)
Table 28.
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 25
.
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
相關(guān)PDF資料
PDF描述
SC16C752BIBS 5 V, 2.2 V and 2.5 V dual UART, 5 Mbit-s (max.), with 64-byte FIFOs
SC16C754BIA68 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit-s (max.) with 64-byte FIFOs
SC16C754BIB80 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit-s (max.) with 64-byte FIFOs
SC16C754BIBM 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit-s (max.) with 64-byte FIFOs
SC16C850IBS 2.5 V to 3.3 V UART, 5 Mbit-s (max.) with 128-byte FIFOs, infrared (IrDA), and 16 mode or 68 mode parallel bus interface
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C752BIB48,128 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C752BIB48,151 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C752BIB48,157 功能描述:UART 接口集成電路 2CH. UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C752BIB48151 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:
SC16C752BIB48-F 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*