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參數(shù)資料
| 型號： | SAH-XC2712X-8F66R |
| 廠商： | INFINEON TECHNOLOGIES AG |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, FLASH, 66 MHz, RISC MICROCONTROLLER, PDSO38 |
| 封裝： | 0.50 MM PITCH, GREEN, PLASTIC, TSSOP-38 |
| 文件頁數(shù)： | 4/103頁 |
| 文件大?。?/td> | 2957K |
| 代理商： | SAH-XC2712X-8F66R |
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XC2712X
XC2000 Family / Compact Line
Package and Reliability
PRELIMINARY
Data Sheet
97
V1.0, 2010-12
5.2
Thermal Considerations
When operating the XC2712X in a system, the total heat generated in the chip must be
dissipated to the ambient environment to prevent overheating and the resulting thermal
damage.
The maximum heat that can be dissipated depends on the package and its integration
into the target board. The “Thermal resistance
RΘJA” quantifies these parameters. The
power dissipation must be limited so that the average junction temperature does not
exceed 150 °C.
The difference between junction temperature and ambient temperature is determined by
ΔT = (P
INT + PIOSTAT + PIODYN) × R
ΘJA
The internal power consumption is defined as
P
INT = VDDP × IDDP (switching current and leakage current).
The static external power consumption caused by the output drivers is defined as
P
IOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL)
The dynamic external power consumption caused by the output drivers (
P
IODYN) depends
on the capacitive load connected to the respective pins and their switching frequencies.
If the total power dissipation for a given system configuration exceeds the defined limit,
countermeasures must be taken to ensure proper system operation:
Reduce
V
DDP, if possible in the system
Reduce the system frequency
Reduce the number of output pins
Reduce the load on active output drivers
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