- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄365460 > S71WS512NC0BFWE72 (Spansion Inc.) Stacked Multi-Chip Product (MCP) PDF資料下載
參數(shù)資料
| 型號： | S71WS512NC0BFWE72 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP） |
| 文件頁數(shù)： | 33/188頁 |
| 文件大小： | 2252K |
| 代理商： | S71WS512NC0BFWE72 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁當(dāng)前第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁第161頁第162頁第163頁第164頁第165頁第166頁第167頁第168頁第169頁第170頁第171頁第172頁第173頁第174頁第175頁第176頁第177頁第178頁第179頁第180頁第181頁第182頁第183頁第184頁第185頁第186頁第187頁第188頁
September 15, 2005 S71WS-N_01_A4
S71WS-Nx0 Based MCPs
31
A d v a n c e I n f o r m a t i o n
10.3.7
Configuration Register
The configuration register sets various operational parameters associated with burst mode. Upon
power-up or hardware reset, the device defaults to the asynchronous read mode, and the config-
uration register settings are in their default state. The host system should determine the proper
settings for the entire configuration register, and then execute the Set Configuration Register
command sequence, before attempting burst operations. The configuration register is not reset
after deasserting CE#. The Configuration Register can also be read using a command sequence
(see
Table 15.1
). The following list describes the register settings.
Table 10.9 Configuration Register
Reading the Configuration Table.
The configuration register can be read with a four-cycle com-
mand sequence. See
Table 15.1
for sequence details. Once the data has been read from the
configuration register, a software reset command is required to set the device into the correct
state.
CR Bit
Function
Settings (Binary)
CR15
Set Device Read
Mode
0 = Synchronous Read (Burst Mode) Enabled
1 = Asynchronous Read Mode (default) Enabled
CR14
Reserved
1 = S29WS256N at 6 or 7 Wait State setting
0 = All others
54 MHz
66 Mhz
80 MHz
CR13
Programmable
Wait State
S29WS128N
0
1
1
011 = Data valid on 5th active CLK edge after addresses
latched
100 = Data valid on 6th active CLK edge after addresses
latched
101 = Data valid on 7th active CLK edge after addresses
latched (default)
110 = Reserved
111 = Reserved
Inserts wait states before initial data is available. Setting
greater number of wait states before initial data reduces
latency after initial data.
(Notes
1
,
2
)
S29WS256N
CR12
S29WS128N
1
0
0
S29WS256N
CR11
S29WS128N
1
0
1
S29WS256N
CR10
RDY Polarity
0 = RDY signal active low
1 = RDY signal active high (default)
CR9
Reserved
1 = default
CR8
RDY
0 = RDY active one clock cycle before data
1 = RDY active with data (default)
When CR13-CR11 are set to 000, RDY is active with data
regardless of CR8 setting.
CR7
Reserved
1 = default
CR6
Reserved
1 = default
CR5
Reserved
0 = default
CR4
Reserved
0 = default
CR3
Burst Wrap Around
0 = No Wrap Around Burst
1 = Wrap Around Burst (default)
CR2
CR1
CR0
Burst Length
000 = Continuous (default)
010 = 8-Word Linear Burst
011 = 16-Word Linear Burst
100 = 32-Word Linear Burst
(All other bit settings are reserved)
Notes:
1.
2.
3.
Refer to
Tables
10.2
-
10.7
for wait states requirements.
Refer to Synchronous Burst Read timing diagrams
Configuration Register is in the default state upon power-up or hardware reset.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| S71WS512NC0BFWE73 | Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BFWY20 | Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BFWY22 | Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BFWY23 | Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BFWY30 | Stacked Multi-Chip Product (MCP) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71WS512NC0BFWE73 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BFWEJ0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BFWEJ2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BFWEJ3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS512NC0BFWEK0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。