參數(shù)資料
型號(hào): S71WS512N80BAEZZ2
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM CMOS 1.8 Volt
中文描述: 堆疊式多芯片產(chǎn)品(MCP)的閃存和移動(dòng)存儲(chǔ)芯片的CMOS 1.8伏特
文件頁數(shù): 114/142頁
文件大小: 1996K
代理商: S71WS512N80BAEZZ2
114
128Mb pSRAM
S71WS512NE0BFWZZ_00_A1 June 28, 2004
P r e l i m i n a r y
AC CHARACTERISTICS (Continued)
SYNCHRONOUS WRITE OPERATION (BURST MODE)
Notes
*1: Defined from the valid input edge to the High to Low transition of either ADV#, CE#1, or WE#, whichever
occurs last. And once they are determined, they must not be changed until the end of burst.
*2: The output load 50pF with 50ohm termination to V
DDQ
*0.5 V.
*3: Defined from the valid clock edge where last data-in being latched at the end of burst write to the High to
Low transition of either ADV# or CE#1 whichever occurs late for the next access.
*4: Defined from the Low to High transition of CE#1 to the High to Low transition of either ADV# or CE#1
whichever occurs late for the next access.
Parameter
Symbol
Value
Unit
Notes
Min.
Max.
Burst Write Cycle Time
t
WCB
8000
ns
Data Setup Time to Clock
t
DSCK
5
ns
Data Hold Time from CLK
t
DHCK
3
ns
WE# Low Setup Time to 1st Data In
t
WLD
30
ns
UB#, LB# Setup Time for Write
t
BS
–5
ns
*1
WE# Setup Time to CLK
t
WSCK
5
ns
WE# Hold Time from CLK
t
CKWH
5
ns
CE#1 Low to WAIT# High
t
CLTH
5
20
ns
*2
WE# Low to WAIT# High
t
WLTH
0
20
ns
*2
CE#1 High to WAIT# High-Z
t
CHTZ
20
ns
*2
WE# High to WAIT# High-Z
t
WHTZ
20
ns
*2
Burst End CE#1 Low Hold Time from CLK
t
CKCLH
5
ns
Burst End CE#1 High Setup Time to next CLK
t
CHCK
5
ns
Burst End UB#, LB# Hold Time from CLK
t
CKBH
5
ns
Burst Write Recovery Time
t
WRB
26
ns
*3
Burst Terminate Recovery
Time
BL=8,16
t
TRB
26
ns
*4
BL=Continuous
t
TRB
70
ns
*4
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S71WS512N80BAIZZ2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM CMOS 1.8 Volt
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S71WS512N80BAWZZ0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM CMOS 1.8 Volt