參數(shù)資料
型號: S70WS512N00BFWAB3
廠商: Spansion Inc.
英文描述: Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
中文描述: 同硅晶片堆疊多芯片產(chǎn)品(MCP)的512兆位(32兆× 16位)的CMOS 1.8伏,只有同時讀/寫,突發(fā)模式閃存
文件頁數(shù): 84/93頁
文件大?。?/td> 846K
代理商: S70WS512N00BFWAB3
March 14, 2005 S70WS512N00_00_A0
S70WS512N00 Based MCPs
85
A d v a n c e I n f o r m a t i o n
13 Appendix
This section contains information relating to software control or interfacing with the Flash device.
For additional information and assistance regarding software, see the
Additional Resources
on
page 18, or explore the Web at
www.amd.com
and
www.fujitsu.com
.
相關PDF資料
PDF描述
S71AL016D Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02-B7 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF0 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71AL016D02BAWBF2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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