參數(shù)資料
型號(hào): S70WS512N00BFWAB3
廠商: Spansion Inc.
英文描述: Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
中文描述: 同硅晶片堆疊多芯片產(chǎn)品(MCP)的512兆位(32兆× 16位)的CMOS 1.8伏,只有同時(shí)讀/寫,突發(fā)模式閃存
文件頁(yè)數(shù): 1/93頁(yè)
文件大小: 846K
代理商: S70WS512N00BFWAB3
This document contains information on one or more products under development at Spansion LLC. The information is intended to help you evaluate this product. Do not
design in this product without contacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed product without notice.
Publication Number
S70WS512N00_00
Revision
A
Amendment
0
Issue Date
March 14, 2005
S70WS512N00 Based MCPs
Same-Die Stacked Multi-Chip Product (MCP)
512 Megabit (32M x 16 bit) CMOS
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory
ADVANCE
INFORMATION
Data Sheet
Notice to Readers:
This document states the current technical specifications
regarding the Spansion product(s) described herein. Each product described
herein may be designated as Advance Information, Preliminary, or Full
Production. See
Notice On Data Sheet Designations
for definitions.
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