參數(shù)資料
型號(hào)： S29GL064A10BAIW12
廠商： SPANSION LLC
元件分類： PROM
英文描述： 4M X 16 FLASH 3V PROM, 100 ns, PBGA64
封裝： FBGA-64
文件頁數(shù)： 11/97頁
文件大?。?/td> 3490K
代理商： S29GL064A10BAIW12
January 11, 2006 S29GL-A_00_A5
S29GL-A MirrorBit Flash Family
17
Pr el im i n a r y
Ordering Information–S29GL032A
S29GL032A Standard Products
Standard products are available in several packages and operating ranges. The
order number (Valid Combination) is formed by a combination of the following:
S29GL032A
90
T
A
I
R1
0
PACKING TYPE
0= Tray
2
= 7-inch Tape and Reel
3
= 13-inch Tape and Reel
MODEL NUMBER
R1
= x8/x16, VCC=3.0 – 3.6 V, Uniform sector device, highest address sector
protected when WP#/ACC=VIL
R2
= x8/x16, VCC=3.0 – 3.6 V, Uniform sector device, lowest address sector protected
when WP#/ACC=VIL
R3
= x8/x16, VCC=3.0 – 3.6 V, Top boot sector device, top two address sectors
protected when WP#/ACC=VIL
R4
= x8/x16, VCC=3.0 – 3.6 V, Bottom boot sector device, bottom two address sectors
protected when WP#/ACC=VIL
W1
= x16 VCC=2.7 – 3.6 V, 56-ball FBGA, Uniform sector device, highest address
sector protected when WP#/ACC=VIL*
W2
= x16 VCC=2.7 – 3.6 V, 56-ball FBGA, Uniform sector device, lowest address sector
protected when WP#/ACC=VIL *
W3
= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, top boot sector device *
W4
= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, bottom boot sector device*
*W1, W2, W3 and W4 are MCP-compatible packages for cellular handsets only
TEMPERATURE RANGE
I
= Industrial (–40°C to +85°C)
PACKAGE MATERIAL SET
A= Standard
F= Pb-Free
PACKAGE TYPE
T
= Thin Small Outline Package (TSOP) Standard Pinout
B
= Fine-pitch Ball-Grid Array Package
F
= Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29GL032A
32 Megabit Page-Mode Flash Memory Manufactured using 200 nm MirrorBit Process Technology, 3.0 Volt-only Read, Program, and Erase
Table 2. S29GL032A Ordering Options
S29GL032A Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material,
& Temperature Range
Model
Number
Packing
Type
S29GL032A
90, 10, 11
TAI,TFI
R1, R2
0,2,3
TS056 (Note 2)
TSOP
FAI,FFI
LAA064 (Note 3) Fortified BGA
TAI,TFI
R3,R4
TS048 (Note 2)
TSOP
BAI,BFI
VBK048 (Note 3) Fine-Pitch BGA
FAI,FFI
LAA064 (Note 3) Fortified BGA
10, 11
BAI,BFI
W1,W2,W3,W4
VBU056 (Note 3) Fine-Pitch BGA (For cellular handsets only)
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be
packed in Types 0 and 3; BGAs can be packed in Types 0, 2,
or 3.
2. TSOP package marking omits packing type designator from
ordering part number.
3. BGA package marking omits leading S29 and packing type
designator from ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume
for this device. Consult your local sales office to confirm availability of
specific valid combinations and to check on newly released combinations.
相關(guān)PDF資料
PDF描述
S29GL128N11FAIVH0 16M X 16 FLASH 3V PROM, 110 ns, PBGA64
S29GL128N11FFIVH2 16M X 16 FLASH 3V PROM, 110 ns, PBGA64
S29JL032J70TFI213 2M X 16 FLASH 3V PROM, 70 ns, PDSO48
S29PL032J65BFI150 2M X 16 FLASH 3V PROM, 65 ns, PBGA56
S29PL127J70BFI000 8M X 16 FLASH 3V PROM, 70 ns, PBGA80
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S29GL064A10FAIR10 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 64MBIT 8MX8/4MX16 100NS 64BGA - Trays
S29GL064A10FAIR50 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 64MBIT 4MX16 100NS 64BGA - Trays
S29GL064A10FFIR30 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 64MBIT 8MX8/4MX16 100NS 64BGA - Trays
S29GL064A10TAIR42 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 64MBIT 8MX8/4MX16 100NS 48TSOP - Tape and Reel
S29GL064A10TAIR60 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 64MBIT 4MX16 100NS 48TSOP - Trays
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*