參數(shù)資料
型號: RK80530KZ017512
英文描述: MICROPROCESSOR|32-BIT|CMOS|PGA|370PIN|CERAMIC
中文描述: 微處理器| 32位|的CMOS |美巡賽| 370PIN |陶瓷
文件頁數(shù): 5/86頁
文件大小: 882K
代理商: RK80530KZ017512
Datasheet
5
Intel
Pentium
III Processor with 512KB L2 Cache at 1.13GHz to 1.40GHz
List of Figures
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Integrated Heat Spreader (IHS) ............................................................................7
AGTL Bus Topology in a Uniprocessor Configuration.........................................12
Stop Clock State Machine...................................................................................13
PLL Filter Specification........................................................................................16
Differential/Single-Ended Clocking Example.......................................................18
V
TT
Power Good and Bus Select Interconnect Diagram.....................................20
BSEL[1:0] Example for a System Design............................................................23
Vcc Static & Transient Tolerance........................................................................27
Clock Waveform..................................................................................................37
BCLK/BCLK#, PICCLK, and TCK Generic Clock Waveform ..............................37
System Bus Valid Delay Timings ........................................................................38
System Bus Setup and Hold Timings..................................................................38
System Bus Reset and Configuration Timings....................................................39
Platform Power-On Sequence and Timings........................................................39
Power-On Reset and Configuration Timings.......................................................40
Test Timings (TAP Connection)..........................................................................40
Test Reset Timings .............................................................................................41
BCLK/BCLK#, PICCLK Generic Clock Waveform at the Processor Pins ...........43
Low to High AGTL Receiver Ringback Tolerance...............................................44
Maximum Acceptable AGTL Overshoot/Undershoot Waveform.........................48
Non-AGTL Overshoot/Undershoot, Settling Limit, and Ringback ......................49
Package Dimensions...........................................................................................55
FC-PGA2 IHS Flatness Specification..................................................................57
Volumetric Keep-Out...........................................................................................57
Component Keep-Out .........................................................................................58
Top Side Processor Markings.............................................................................58
Pentium
III Processor with 512KB L2 Cache Pinout.........................................59
Conceptual Boxed Pentium
III Processor with 512KB L2 Cache for the PGA370
Socket .................................................................................................................71
Comparison between FC-PGA and FC-PGA2 package......................................72
Side View of Space Requirements for the Boxed Processor..............................73
Dimensions of Mechanical Step Feature in Heatsink Base.................................73
Thermal Airspace Requirement for all Boxed Pentium
III Processor with 512KB
L2 Cache Fan Heatsink in the PGA370 Socket ..................................................74
Boxed Processor Fan Heatsink Power Cable Connector Description.................75
Motherboard Power Header Placement
Relative to the Boxed Pentium
III Processor with 512KB L2 Cache .................76
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