
Rev. 1.00 Mar. 18, 2008 Page xxiii of xxiv
Section 24 Power-Down Modes ........................................................................733
24.1
Register Descriptions ......................................................................................................... 734
24.1.1 Standby Control Register (SBYCR) ..................................................................... 734
24.1.2 Low-Power Control Register (LPWRCR) ............................................................ 737
24.1.3 Module Stop Control Registers H, L, A, and B (MSTPCRH, MSTPCRL,
MSTPCRA, MSTPCRB) ...................................................................................... 738
24.2
Mode Transitions and LSI States ....................................................................................... 741
24.3
Medium-Speed Mode......................................................................................................... 743
24.4
Sleep Mode ........................................................................................................................ 744
24.5
Software Standby Mode..................................................................................................... 745
24.6
Watch Mode....................................................................................................................... 747
24.7
Module Stop Mode ............................................................................................................ 748
24.8
Usage Notes ....................................................................................................................... 748
24.8.1 I/O Port Status....................................................................................................... 748
24.8.2 Current Consumption when Waiting for Oscillation Stabilization ....................... 748
Section 25 List of Registers ...............................................................................749
25.1
Register Addresses (Address Order).................................................................................. 751
25.2
Register Bits....................................................................................................................... 770
25.3
Register States in Each Operating Mode ........................................................................... 784
25.4
Register Selection Condition ............................................................................................. 796
25.5
Register Addresses (Classification by Type of Module) ................................................... 813
Section 26 Electrical Characteristics .................................................................829
26.1
Absolute Maximum Ratings .............................................................................................. 829
26.2
DC Characteristics ............................................................................................................. 830
26.3
AC Characteristics ............................................................................................................. 837
26.3.1 Clock Timing ........................................................................................................ 837
26.3.2 Control Signal Timing .......................................................................................... 840
26.3.3 Timing of On-Chip Peripheral Modules ............................................................... 842
26.4
A/D Conversion Characteristics......................................................................................... 851
26.5
Flash Memory Characteristics ........................................................................................... 852
26.6
Power-on Reset Characteristics ......................................................................................... 853
26.7
Usage Notes ....................................................................................................................... 854
Appendix
.........................................................................................................855
A.
I/O Port States in Each Pin State........................................................................................ 855
B.
Product Lineup................................................................................................................... 856
C.
Package Dimensions .......................................................................................................... 857
D.
Treatment of Unused Pins.................................................................................................. 860