參數(shù)資料
型號: PID9q-604e
廠商: IBM Microeletronics
英文描述: 32-Bit RISC Microprocessor(32位精簡指令集微處理器)
中文描述: 32位RISC微處理器(32位精簡指令集微處理器)
文件頁數(shù): 16/29頁
文件大小: 543K
代理商: PID9Q-604E
16
PID9q-604e Hardware Datasheet
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
IBM
1.5 Pin Assignments
IBM both offer a ceramic ball grid array (CBGA) package. IBM CBGA packages have identical pinouts.
Figure 9 (in part A) shows the pinout of the CBGA package as viewed from the top surface. Part B shows
the side profile of the CBGA package to indicate the direction of the top surface view.
Part A
Figure 9. Pinout of the CBGA Package as Viewed from the Top Surface
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
01 02 03 04 05 06 07 08
09 10 11 12 13 14 15 16
Not to Scale
View
Part B
Substrate Assembly
Encapsulant
Die
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