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參數(shù)資料
| 型號(hào)： | PC755M8 |
| 英文描述： | PC755M8 [Updated 6/03. 35 Pages] 32-bit RISC PowerPC-based Multichip Module |
| 中文描述： | PC755M8 [更新6月3日。 35頁] 32位RISC PowerPC的多芯片模塊 |
| 文件頁數(shù)： | 36/50頁 |
| 文件大?。?/td> | 1064K |
| 代理商： | PC755M8 |
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36
PC755/745
2138D–HIREL–06/03
The COP header shown in Figure 24 adds many benefits—breakpoints, watchpoints,
register and memory examination/modification and other standard debugger features
are possible through this interface – and can be as inexpensive as an unpopulated foot-
print for a header to be added when needed.
System design information
The COP interface has a standard header for connection to the target system, based on
the 0.025” square-post 0.100” centered header assembly (often called a “Berg” header).
The connector typically has pin 14 removed as a connector key.
Figure 24 shows the COP connector diagram.
Figure 24.
COP Connector Diagram
There is no standardized way to number the COP header shown in Figure 24; conse-
quently, many different pin numbers have been observed from emulator vendors. Some
are numbered top-to-bottom then left-to-right, while others use left-to-right then top-to-
bottom, while still others number the pins counter clockwise from pin one (as with an IC).
Regardless of the numbering, the signal placement recommended in Figure 24 is com-
mon to all known emulators.
The QACK signal shown in Table 17 is usually hooked up to the PCI bridge chip in a
system and is an input to the PC755 informing it that it can go into the quiescent state.
Under normal operation this occurs during a low power mode selection. In order for
COP to work the PC755 must see this signal asserted (pulled down). While shown on
the COP header, not all emulator products drive this signal. To preserve correct power
down operation, QACK should be merged so that it also can be driven by the PCI
bridge.
3
C
13
9
5
1
6
10
2
TOP VIEW
15
11
7
16
12
8
4
No pin
H
S
T
R
T
T
T
G
T
V
Pins 10, 12 and 14 are no-connects.
Pin 14 is not physically present
Q
C
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| PC755CMGHU350LE | PowerPC 755/745 RISC Microprocessor |
| PC755CMGHU366LE | PowerPC 755/745 RISC Microprocessor |
| PC755CMGHU400LE | PowerPC 755/745 RISC Microprocessor |
| PC755CMGSU300LE | PowerPC 755/745 RISC Microprocessor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PC75B | 制造商:Datak Corporation 功能描述: |
| PC75-C | 功能描述:PCB COPPER CLAD 4.5X7" 2 SIDE RoHS:是 類別:原型開發(fā)產(chǎn)品 >> 原型開發(fā)板 - 未穿孔 系列:- 標(biāo)準(zhǔn)包裝:5 系列:500 原型板類型:包銅，無涂層 尺寸/尺寸:36.00" x 24.00"（914.4mm x 609.6mm） 板厚度:0.063"（1.60mm）1/16" 材質(zhì):雙面包銅 FR4，1 盎斯 |
| PC75P | 功能描述:PCB COPPER CLAD POS 4 X 6"2 SIDE RoHS:是 類別:原型開發(fā)產(chǎn)品 >> 原型開發(fā)板 - 未穿孔 系列:- 標(biāo)準(zhǔn)包裝:5 系列:500 原型板類型:包銅，無涂層 尺寸/尺寸:36.00" x 24.00"（914.4mm x 609.6mm） 板厚度:0.063"（1.60mm）1/16" 材質(zhì):雙面包銅 FR4，1 盎斯 |
| PC75P-C | 功能描述:PCB COPPER CLAD POS 4.5X7"2 SIDE RoHS:是 類別:原型開發(fā)產(chǎn)品 >> 原型開發(fā)板 - 未穿孔 系列:- 標(biāo)準(zhǔn)包裝:5 系列:500 原型板類型:包銅，無涂層 尺寸/尺寸:36.00" x 24.00"（914.4mm x 609.6mm） 板厚度:0.063"（1.60mm）1/16" 材質(zhì):雙面包銅 FR4，1 盎斯 |
| PC75P-S | 功能描述:PCB COPPER CLAD POS 6 X 6"2 SIDE RoHS:是 類別:原型開發(fā)產(chǎn)品 >> 原型開發(fā)板 - 未穿孔 系列:- 標(biāo)準(zhǔn)包裝:5 系列:500 原型板類型:包銅，無涂層 尺寸/尺寸:36.00" x 24.00"（914.4mm x 609.6mm） 板厚度:0.063"（1.60mm）1/16" 材質(zhì):雙面包銅 FR4，1 盎斯 |
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