參數(shù)資料
型號: OM6213
英文描述: 48 x 84 pixels matrix LCD driver
中文描述: 48 × 84像素的矩陣LCD驅(qū)動器
文件頁數(shù): 31/40頁
文件大?。?/td> 213K
代理商: OM6213
2001 Nov 07
31
Philips Semiconductors
Product specification
48
×
84 pixels matrix LCD driver
OM6213
21 CHIP INFORMATION
The OM6213 is manufactured in n-well CMOS technology.
22 BONDING PAD INFORMATION
Table 19
Bonding pad information
NAME
ROW/COL SIDE
INTERFACE SIDE
Pad pitch
Pad size, aluminium
CBB opening
Bump dimensions
Wafer thickness (excluding bumps)
60
μ
m (min.)
50
×
90
μ
m (min.)
26
×
66
μ
m (min.)
40
×
80
×
17.5
μ
m (
±
5) (min.)
381
μ
m (
±
25)
70
μ
m (min.)
60
×
100
μ
m (min.)
36
×
76
μ
m (min.)
50
×
90
×
17.5
μ
m (
±
5) (min.)
handbook, halfpage
MGT854
9.11 mm
pitch
1.78
mm
OM6213
x
y
Fig.20 Bonding pads.
MGT855
handbook, halfpage
x
center
y
center
100
μ
m
Fig.21 Shape of alignment mark (100
μ
m
diameter).
相關(guān)PDF資料
PDF描述
OM6218SP1 TRANSISTOR | MOSFET | MATCHED PAIR | N-CHANNEL | 60V V(BR)DSS | 20A I(D) | SIP
OM6416SP3 TRANSISTOR | MOSFET POWER MODULE | 3-PH BRIDGE | 500V V(BR)DSS | 2A I(D)
OM6417SP6 TRANSISTOR | MOSFET POWER MODULE | FULL BRIDGE | 50V V(BR)DSS | 5A I(D)
OM6418SP6 TRANSISTOR | MOSFET POWER MODULE | FULL BRIDGE | 100V V(BR)DSS | 5A I(D)
OM6419SP6 TRANSISTOR | MOSFET POWER MODULE | FULL BRIDGE | 200V V(BR)DSS | 2A I(D)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
OM6214SS 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TWO POWER MOSFETS IN HERMETIC ISOLATED SIP PACKAGE
OM6215SS 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TWO POWER MOSFETS IN HERMETIC ISOLATED SIP PACKAGE
OM6215SSP 制造商:International Rectifier 功能描述:TRANS MOSFET N-CH 200V 25A 4PIN SOT-223 - Tape and Reel
OM6215SST 制造商:International Rectifier 功能描述:TRANS MOSFET N-CH 200V 25A 6SIP - Bulk
OM6216SS 制造商:未知廠家 制造商全稱:未知廠家 功能描述:TWO POWER MOSFETS IN HERMETIC ISOLATED SIP PACKAGE