
NTD3055150
http://onsemi.com
4
V
GS
V
DS
4
10
6
0
12
4
10
320
20
10
0
C
0
Q
g
, TOTAL GATE CHARGE (nC)
Figure 7. Capacitance Variation
Figure 8. GatetoSource and
DraintoSource Voltage versus Total Charge
V
G
,
1
100
10
10
100
Figure 9. Resistive Switching Time Variation
versus Gate Resistance
R
G
, GATE RESISTANCE ( )
Figure 10. Diode Forward Voltage versus
Current
V
SD
, SOURCETODRAIN VOLTAGE (VOLTS)
I
S
,
t
560
0
1
6
0.6
0.92
0.84
0.76
0.68
1
6
2
0
8
10
GATETOSOURCE OR DRAINTOSOURCE VOLTAGE (V)
160
240
400
25
2
I
D
= 9 A
T
J
= 25
°
C
Q
2
Q
1
V
GS
Q
T
V
DS
= 30 V
I
D
= 9 A
V
GS
= 10 V
t
r
t
d(off)
t
d(on)
t
f
V
GS
= 0 V
T
J
= 25
°
C
V
GS
= 0 V
V
DS
= 0 V
T
J
= 25
°
C
C
rss
C
iss
C
oss
C
rss
C
iss
2
3
4
5
80
480
15
5
5
7
8
8
16
0.1
100
10
100
Figure 11. Maximum Rated Forward Biased
Safe Operating Area
V
DS
, DRAINTOSOURCE VOLTAGE (VOLTS)
Figure 12. Maximum Avalanche Energy versus
Starting Junction Temperature
T
J
, STARTING JUNCTION TEMPERATURE (
°
C)
E
A
,
A
I
D
,
25
125
100
75
50
24
8
0
32
V
GS
= 20 V
SINGLE PULSE
T
C
= 25
°
C
I
D
= 7.75 A
175
150
1
10
1
0.1
R
DS(on)
LIMIT
THERMAL LIMIT
PACKAGE LIMIT
10 ms
10 s
1 ms
dc
100 s