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DDR_x4x8x16_Core2.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN
19
2003 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 DDR SDRAM
Electrical Specifications – DC and AC
Table 11:
DC Electrical Characteristics and Operating Conditions (-6, -6T, -75E, -75Z, -75)
Notes: 1–5, 17 apply to the entire table; Notes appear on page 35; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V Parameter/Condition
Symbol
Min
Max
Units
Notes
Supply voltage
VDD
+2.3
+2.7
V
I/O supply voltage
VDDQ
+2.3
+2.7
V
I/O reference voltage
VREF
0.49 × VDDQ
0.51 × VDDQ
V
I/O termination voltage (system)
VTT
VREF - 0.04
VREF + 0.04
V
Input high (logic 1) voltage
VIH(DC)VREF + 0.15
VDD + 0.3
V
Input low (logic 0) voltage
VIL(DC)–0.3
VREF - 0.15
V
Input leakage current:
Any input 0V
≤ VIN ≤ VDD, VREF pin 0V ≤ VIN ≤ 1.35V
(All other pins not under test = 0V)
II
–2
+2
A
Output leakage current:
(DQ are disabled; 0V
≤ VOUT ≤ VDDQ)
IOZ
–5
+5
A
Full-drive option output
levels (x4, x8, x16):
High current (VOUT =
VDDQ - 0.373V, minimum
VREF, minimum VTT)
IOH
–16.8
–
mA
Low current (VOUT =
0.373V, maximum VREF,
maximum VTT)
IOL
+16.8
–
mA
Reduced-drive option
output levels (Design
Revision F and K only):
High current (VOUT =
VDDQ - 0.763V, minimum
VREF, minimum VTT)
IOHR
–9
–
mA
Low current
(VOUT =
0.763V, maximum VREF,
maximum VTT)
IOLR
+9
–
mA
Ambient operating
temperatures
Commercial
TA
0+70
°C
Industrial
TA
–40
+85
°C
Automotive
TA
–40
+105
°C
Table 12:
AC Input Operating Conditions
0°C
≤ T
A ≤ +70°C; VDDQ = +2.5V ±0.2V, VDD = +2.5V ±0.2V (VDDQ = +2.6V ±0.1V, VDD = +2.6V ±0.1V for -5B)
Parameter/Condition
Symbol
Min
Max
Units
Notes
Input high (logic 1) voltage
VIH(AC)VREF + 0.310
–
V
Input low (logic 0) voltage
VIL(AC)–
VREF - 0.310
V
I/O reference voltage
VREF(AC)
0.49 × VDDQ
0.51 × VDDQV