參數(shù)資料
型號(hào)： MPC107APX66L0
廠商： MOTOROLA INC
元件分類： 外設(shè)及接口
英文描述： MULTIFUNCTION PERIPHERAL, PPGA503
封裝： PLASTIC, BGA-503
文件頁(yè)數(shù)： 38/46頁(yè)
文件大小： 585K
代理商： MPC107APX66L0
MPC107 Hardware Specifications (Rev 0.2)
43
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
System Design Information
1.7.6.1 Internal Package Conduction Resistance
For the PBGA packaging technology, the intrinsic conduction thermal resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 26 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 26. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
For this PBGA package, heat is dissipated from the component via several concurrent paths. Heat is
conducted through the silicon and may be removed to the ambient air by convection and/or radiation. In
addition a second, parallel heat ow path exists by conduction in parallel through the C4 bumps and the
epoxy under-ll, to the plastic substrate for further convection cooling off the edges. Then from the plastic
substrate, heat is conducted via the leads/balls to the next-level interconnect (printed-circuit board)
whereupon the primary mode of heat transfer is by convection and/or radiation.
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
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