參數(shù)資料
型號(hào)： MPC106ARX66CG
元件分類： 總線控制器
英文描述： PCI BUS CONTROLLER, CBGA304
封裝： 21 X 25 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-304
文件頁(yè)數(shù)： 32/32頁(yè)
文件大?。?/td> 451K
代理商： MPC106ARX66CG
Tsi106 PowerPC Host Bridge Hardware Specifications Manual
9
80C1000_MA002_02
General Parameters
1.3 General Parameters
The following list provides a summary of the general parameters of the Tsi106:
Technology
0.5 m CMOS, four-layer metal
Die size
5.8 mm x 7.2 mm (41.8 mm2)
Transistor count
250,000
Logic design
Fully-static
Packages
Surface mount 304-lead C4 ceramic ball grid array (CBGA)
Power supply
3.3 V ± 5% V DC
Maximum input rating
5.0 V ± 10% V DC
1.4 Electrical and Thermal Characteristics
This section provides both the AC and DC electrical specifications and thermal characteristics for the
Tsi106.
1.4.1 DC Electrical Characteristics
The tables in this section describe the Tsi106 DC electrical characteristics. Table 1 provides the absolute
maximum ratings. Functional and tested operating conditions are given in Table 2. Absolute maximum
ratings are stress ratings only, and functional operation at the maximums is not guaranteed. Stresses
beyond those listed may affect device reliability or cause it permanent damage.
Table 2 provides the recommended operating conditions for the Tsi106. Proper device operation outside of
these recommended and tested conditions is not guaranteed.
Table 1. Absolute Maximum Ratings
Characteristic
Symbol
Value
Unit
Notes
Supply voltage
Vdd
–0.3 to 3.6
V
—
PLL supply voltage
AVdd
–0.3 to 3.6
V
—
Input voltage
Vin
–0.3 to 5.5
V
1
Junction temperature
Tj
0 to 105
C2
Storage temperature range
Tstg
–55 to 150
C—
Notes:
1 Caution: Vin must not exceed Vdd by more than 2.5 V at all times including during power-on reset.
2 The extended temperature parts have die junction temperature of -40 to 105C.
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