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參數(shù)資料
| 型號(hào)： | MAAPGM0035S-DIE |
| 英文描述： | Amplifier, Power, S/C-Band, 1.6W (2.5-5.5 GHz) |
| 中文描述： | 功率放大器，功率為S / C波段，為1.6W（2.5-5.5千兆赫） |
| 文件頁數(shù)： | 5/5頁 |
| 文件大小： | 318K |
| 代理商： | MAAPGM0035S-DIE |
Amplifier, Power, S/C-Band, 1.6W
2.5-5.5 GHz
MAAPGM0035S-DIE
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
North America
Tel: 800.366.2266 / Fax: 978.366.2266
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com
for additional data sheets and product information.
903179 —
Preliminary Information
5
Figure 4. Recommended bonding diagram
for pedestal mount.
Support circuitry typical of MMIC characterization.
Assembly Instructions:
Die attach:
Use AuSn (80/20) 1 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding:
Bond @ 160 °C using standard ball or thermal compression wedge bond techniques.
For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge
bonds of shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V
GG
before applying positive bias to V
DD
to prevent
damage to amplifier.
Assembly and Bonding Diagram
100 pF
100 pF
100 pF
RF
IN
RF
OUT
0.1
μ
F
V
GG
0.1
μ
F
V
DD
Dashed lines indicate
optional wiring
configuration.
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| MAAPGM0036 | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:1.2-3.2 GHz 1.2W Power Amplifier |
| MAAPGM0036-DIE | 制造商:MA-COM 制造商全稱:M/A-COM Technology Solutions, Inc. 功能描述:1.2-3.2 GHz 1.2W Power Amplifier |
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