M88 FAMILY
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managing discrete Flash memory devices, such
as:
– In-system first-time programming
– Complex address decoding
– Concurrent Flash or EEPROM programming.
The
M88x3Fxx
FLASH+PSD’s
serial
JTAG
interface
allows
in-system-programming
and
eliminates the need for a boot EPROM or Flash
memory, or an external programmer. To simplify
Flash memory updates, some members of the
family perform program execution out of a
secondary EEPROM (for the M8813F1x) or Flash
memory (for the M88x3F2x) while the main Flash
memory is being updated. This solution avoids the
complicated hardware and software overhead
necessary to implement in-system Flash memory
updates.
ST makes available a software development tool,
PSDsoft, that generates ANSI-C compliant code
for use with your target MCU. This code allows you
to manipulate the non-volatile memory (NVM)
within the PSD. Code examples are also provided
for:
– Flash memory ISP via the UART of the host
MCU
– Memory paging to execute code across several
PSD memory pages
– Loading, reading, and manipulation of PSD
Macrocells by the MCU.
KEY FEATURES
s
A simple interface to 8-bit microcontrollers,
without the need for external glue-logic. The bus
interface logic uses the control signals
generated by the microcontroller when the
address is decoded and a read or write is
performed. The MCU families supported
include:
– Intel 8031, 80196, 80186, 80C251, and
80386EX
– Motorola 68HC11, 68HC16, 68HC12, and
683XX
– Philips 8031 and 8051XA
– Zilog Z80 and Z8
– NEURON
3150 CHIP.
s
Internal 1 Mbit (128K x 8) Flash memory. This is
the main Flash memory. It is divided into eight
equal-sized blocks that can be accessed with
user-specified addresses.
s
Optional internal secondary 256 Kbit (32K x 8)
EEPROM or Flash boot memory. This is divided
into four equal-sized blocks that can be
accessed with user-specified addresses. The
main Flash memory can be updated
concurrently while the secondary memory is
executing code.
s
Optional 16 Kbit (2K x 8) scratch-pad SRAM. Its
contents can be protected from a power failure
by connecting an external battery.
Table 3. Absolute Maximum Ratings 1
Note: 1. Except for the rating “Operating Temperature Range”, stresses above those listed in the Table “Absolute Maximum Ratings” may
cause permanent damage to the device. These are stress ratings only, and operation of the device at these or any other conditions
above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating condi-
tions for extended periods may affect device reliability . Refer also to the ST SURE Program and other relevant quality documents.
2. MIL-STD- 883C, 3015.7 (100 pF, 1500
)
3. For the M88x3FxY, 5 V range only.
Symbol
Parameter
Value
Unit
TA
Ambient Operating Temperature
Industrial
-40 to 85
°C
Commercial
0 to 70
°C
TSTG
Storage Temperature
-65 to 125
°C
TLEAD
Lead Temperature during Soldering
t.b.c.
°C
VCC
Supply Voltage
–0.6 to 73
V
VPP
Device Programmer Supply Voltage
–0.6 to 143
V
VIO
Input or Output range (Q = VOH or Hi-Z)
–0.6 to 73
V
VESD
Electrostatic Discharge Voltage (Human Body model) 2
2000
V