- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄4339 > M1AGLE3000V2-FGG896I (Microsemi SoC)IC FPGA 1KB FLASH 3M 896-FBGA PDF資料下載
參數(shù)資料
| 型號： | M1AGLE3000V2-FGG896I |
| 廠商： | Microsemi SoC |
| 文件頁數(shù)： | 34/166頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPGA 1KB FLASH 3M 896-FBGA |
| 標(biāo)準(zhǔn)包裝： | 27 |
| 系列： | IGLOOe |
| 邏輯元件/單元數(shù)： | 75264 |
| RAM 位總計： | 516096 |
| 輸入/輸出數(shù)： | 620 |
| 門數(shù)： | 3000000 |
| 電源電壓： | 1.14 V ~ 1.575 V |
| 安裝類型： | 表面貼裝 |
| 工作溫度： | -40°C ~ 85°C |
| 封裝/外殼： | 896-BGA |
| 供應(yīng)商設(shè)備封裝： | 896-FBGA（31x31） |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁當(dāng)前第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁第101頁第102頁第103頁第104頁第105頁第106頁第107頁第108頁第109頁第110頁第111頁第112頁第113頁第114頁第115頁第116頁第117頁第118頁第119頁第120頁第121頁第122頁第123頁第124頁第125頁第126頁第127頁第128頁第129頁第130頁第131頁第132頁第133頁第134頁第135頁第136頁第137頁第138頁第139頁第140頁第141頁第142頁第143頁第144頁第145頁第146頁第147頁第148頁第149頁第150頁第151頁第152頁第153頁第154頁第155頁第156頁第157頁第158頁第159頁第160頁第161頁第162頁第163頁第164頁第165頁第166頁
IGLOOe Low Power Flash FPGAs
Revision 13
3-5
TDI
Test Data Input
Serial input for JTAG boundary scan, ISP, and UJTAG usage. There is an internal weak pull-up resistor
on the TDI pin.
TDO
Test Data Output
Serial output for JTAG boundary scan, ISP, and UJTAG usage.
TMS
Test Mode Select
The TMS pin controls the use of the IEEE 1532 boundary scan pins (TCK, TDI, TDO, TRST). There is an
internal weak pull-up resistor on the TMS pin.
TRST
Boundary Scan Reset Pin
The TRST pin functions as an active-low input to asynchronously initialize (or reset) the boundary scan
circuitry. There is an internal weak pull-up resistor on the TRST pin. If JTAG is not used, an external pull-
down resistor could be included to ensure the test access port (TAP) is held in reset mode. The resistor
values must be chosen from Table 3-2 and must satisfy the parallel resistance value requirement. The
values in Table 3-2 correspond to the resistor recommended when a single device is used, and the
equivalent parallel resistor when multiple devices are connected via a JTAG chain.
In critical applications, an upset in the JTAG circuit could allow entrance to an undesired JTAG state. In
such cases, Microsemi recommends tying off TRST to GND through a resistor placed close to the FPGA
pin.
Note that to operate at all VJTAG voltages, 500
to 1 k will satisfy the requirements.
Special Function Pins
NC
No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC
Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Packaging
Semiconductor technology is constantly shrinking in size while growing in capability and functional
integration. To enable next-generation silicon technologies, semiconductor packages have also evolved
to provide improved performance and flexibility.
Microsemi consistently delivers packages that provide the necessary mechanical and environmental
protection to ensure consistent reliability and performance. Microsemi IC packaging technology
efficiently supports high-density FPGAs with large-pin-count Ball Grid Arrays (BGAs), but is also flexible
enough to accommodate stringent form factor requirements for Chip Scale Packaging (CSP). In addition,
Microsemi offers a variety of packages designed to meet your most demanding application and economic
requirements for today's embedded and mobile systems.
Table 3-3 TRST and TCK Pull-Down Recommendations
VJTAG
Tie-Off Resistance*
VJTAG at 3.3 V
200
to 1 k
VJTAG at 2.5 V
200
to 1 k
VJTAG at 1.8 V
500
to 1 k
VJTAG at 1.5 V
500
to 1 k
Note: Equivalent parallel resistance if more than one device is on the JTAG chain
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 24LC024T-I/SN | IC EEPROM 2KBIT 400KHZ 8SOIC |
| APA1000-PQG208I | IC FPGA PROASIC+ 1M 208-PQFP |
| 24LC024-I/SN | IC EEPROM 2KBIT 400KHZ 8SOIC |
| APA1000-PQ208I | IC FPGA PROASIC+ 1M 208-PQFP |
| 24C02CT/SN | IC EEPROM 2KBIT 400KHZ 8SOIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M1AGLE3000V2-FGG896PP | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology |
| M1AGLE3000V5-FFG484 | 制造商:Microsemi Corporation 功能描述:FPGA IGLOOE 3M GATES 130NM 1.5V 484FBGA - Trays |
| M1AGLE3000V5-FFG896 | 制造商:Microsemi Corporation 功能描述:FPGA IGLOOE 3M GATES 130NM 1.5V 896FBGA - Trays |
| M1AGLE3000V5-FFG896ES | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology |
| M1AGLE3000V5-FFG896I | 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOOe Low-Power Flash FPGAs with Flash Freeze Technology |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。