參數資料
型號: M13S256328A
廠商: Elite Semiconductor Memory Technology Inc.
英文描述: 2M x 32 Bit x 4 Banks Double Data Rate SDRAM
中文描述: 200萬× 32位× 4個銀行雙倍數據速率SDRAM
文件頁數: 18/47頁
文件大?。?/td> 807K
代理商: M13S256328A
ES MT
M13S256328A
Elite Semiconductor Memory Technology Inc.
Publication Date : May. 2007
Revision : 1.2 18/47
Read Interrupted by a Precharge
A Burst Read operation can be interrupted by precharge of the same bank. The minimum 1 clock is required for the read to
precharge intervals. A precharge command to output disable latency is equivalent to the CAS latency.
<Burst Length = 8, CAS Latency = 3>
When a burst Read command is issued to a DDR SDRAM, a Precharge command may be issued to the same bank before
the Read burst is complete. The following functionality determines when a Precharge command may be given during a Read
burst and when a new Bank Activate command may be issued to the same bank.
1. For the earliest possible Precharge command without interrupting a Read burst, the Precharge command may be given on
the rising clock edge which is CL clock cycles before the end of the Read burst where CL is the CAS Latency. A new Bank
Activate command may be issued to the same bank after t
RP
(RAS precharge time).
2. When a Precharge command interrupts a Read burst operation, the Precharge command may be given on the rising clock
edge which is CL clock cycles before the last data from the interrupted Read burst where CL is the CAS Latency. Once
the last data word has been output, the output buffers are tristated. A new Bank Activate command may be issued to the
same bank after t
RP
.
3. For a Read with autoprecharge command, a new Bank Activate command may be issued to the same bank after t
RP
where
t
RP
begins on the rising clock edge which is CL clock cycles before the end of the Read burst where CL is the CAS
Latency. During Read with autoprecharge, the initiation of the internal precharge occurs at the same time as the earliest
possible external Precharge command would initiate a precharge operation without interrupting the Read burst as described
in 1 above.
4. For all cases above, t
RP
is an analog delay that needs to be converted into clock cycles. The number of clock cycles
between a Precharge command and a new Bank Activate command to the same bank equals t
RP
/ t
CK
(where t
CK
is the clock
cycle time) with the result rounded up to the nearest integer number of clock cycles.
In all cases, a Precharge operation cannot be initiated unless t
RAS
(min) [minimum Bank Activate to Precharge time] has
been satisfied. This includes Read with autoprecharge commands where t
RAS
(min) must still be satisfied such that a Read with
autoprecharge command has the same timing as a Read command followed by the earliest possible Precharge command
which does not interrupt the burst.
C A S L at e n c y= 3
0
1
2
3
4
5
6
7
8
CO MM AN D
DQS
DQ 's
READ
NOP
NOP
NOP
NOP
NOP
NOP
Dout 0
Precharge
Dout 1
1t
C K
NOP
Dout 2 Dout 3 Dout 4 Dout 5
In t er r u p t ed b y p r e c h a r g e
Dout 6 Dout 7
C L K
C L K
相關PDF資料
PDF描述
M13S32321A 256K x 32 Bit x 4 Banks Double Data Rate SDRAM
M13S64164A-6BG 1M x 16 Bit x 4 Banks Double Data Rate SDRAM
M13S64164A 1M x 16 Bit x 4 Banks Double Data Rate SDRAM
M13S64164A-5BG 1M x 16 Bit x 4 Banks Double Data Rate SDRAM
M13S64164A-5TG 1M x 16 Bit x 4 Banks Double Data Rate SDRAM
相關代理商/技術參數
參數描述
M13S256328A-5BG 制造商:ESMT 制造商全稱:Elite Semiconductor Memory Technology Inc. 功能描述:2M x 32 Bit x 4 Banks Double Data Rate SDRAM
M13S32321A 制造商:ESMT 制造商全稱:Elite Semiconductor Memory Technology Inc. 功能描述:256K x 32 Bit x 4 Banks Double Data Rate SDRAM
M13S32321A_08 制造商:ESMT 制造商全稱:Elite Semiconductor Memory Technology Inc. 功能描述:256K x 32 Bit x 4 Banks Double Data Rate SDRAM
M13S32321A-5L 制造商:ESMT 制造商全稱:Elite Semiconductor Memory Technology Inc. 功能描述:256K x 32 Bit x 4 Banks Double Data Rate SDRAM
M13S32321A-6L 制造商:ESMT 制造商全稱:Elite Semiconductor Memory Technology Inc. 功能描述:256K x 32 Bit x 4 Banks Double Data Rate SDRAM