參數(shù)資料
型號: LTAEY
廠商: Linear Integrated Systems
英文描述: Differential Input 16-Bit No Latency DS ADC
中文描述: 差分輸入16位ADC的無延遲局副局長
文件頁數(shù): 27/28頁
文件大?。?/td> 298K
代理商: LTAEY
LTC2433-1
27
24331fa
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
MSOP (MS) 0802
0.53
±
0.01
(.021
±
.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.13
±
0.076
(.005
±
.003)
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2 3 4 5
4.90
±
0.15
(1.93
±
.006)
0.497
±
0.076
(.0196
±
.003)
REF
8
9
10
7 6
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
3.00
±
0.102
(.118
±
.004)
NOTE 4
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
°
– 6
°
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.2 – 3.45
(.126 – .136)
0.889
±
0.127
(.035
±
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
±
0.038
(.0120
±
.0015)
TYP
0.50
(.0197)
BSC
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661)
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