參數(shù)資料
型號: LFX1200B-03F900C
廠商: LATTICE SEMICONDUCTOR CORP
元件分類: FPGA
英文描述: The ispXPGA architecture
中文描述: FPGA, 3844 CLBS, 1250000 GATES, PBGA900
封裝: FPBGA-900
文件頁數(shù): 27/89頁
文件大?。?/td> 941K
代理商: LFX1200B-03F900C
Lattice Semiconductor
ispXPGA Family Data Sheet
27
ispXPGA PFU Timing Parameters
Over Recommended Operating Conditions
Parameter
Description
-4
-3
Units
Min.
Max.
Min.
Max.
Functional Delays
LUTs
t
LUT4
t
LUT5
t
LUT6
Shift Register (LUT)
4-Input LUT Delay
0.44
0.51
ns
5-Input LUT Delay
0.79
0.91
ns
6-Input LUT Delay
0.93
1.07
ns
t
LSR_S
t
LSR_H
t
LSR_CO
Arithmetic Functions
Shift Register Setup Time
-0.62
-0.53
ns
Shift Register Hold Time
0.63
0.72
ns
Shift Register Clock to Output Delay
0.75
0.86
ns
t
LCTHRUR
MC (Macro Cell) Carry In to MC Carry Out Delay (Rip-
ple)
0.09
0.10
ns
t
LCTHRUL
t
LSTHRU
t
LSINCOUT
t
LCINSOUTR
t
LCINSOUTL
Feed-thru
1
MC Carry In to MC Carry Out Delay (Look Ahead)
0.05
0.06
ns
MC Sum In to MC Sum Out Delay
0.45
0.52
ns
MC Sum In to MC Carry Out Delay
0.31
0.36
ns
MC Carry In to MC Sum Out Delay (Ripple)
0.39
0.45
ns
MC Carry In to MC Sum Out Delay (Look Ahead)
0.28
0.32
ns
t
LFT
Distributed RAM
PFU Feed-Thru Delay
0.16
0.18
ns
t
LRAM_CO
t
LRAMAD_S
t
LRAMD_S
t
LRAMWE_S
t
LRAMAD_H
t
LRAMD_H
t
LRAMWE_H
t
LRAMCPW
t
LRAMADO
Register/Latch Delays
Registers
Clock to RAM Output
1.33
1.53
ns
Address Setup Time
-0.40
-0.34
ns
Data Setup Time
0.22
0.25
ns
Write Enable Setup Time
0.46
0.53
ns
Address Hold Time
0.60
0.69
ns
Data Hold Time
0.11
0.13
ns
Write Enable Hold Time
0.12
0.14
ns
Clock Pulse Width (High or Low)
3.00
3.45
ns
Address to Output Delay
0.93
1.07
ns
t
L_CO
t
L_S
t
L_H
t
LCE_S
t
LCE_H
Latches
Register Clock to Output Delay
0.62
0.71
ns
Register Setup Time (Data before Clock)
0.14
0.16
ns
Register Hold Time (Data after Clock)
-0.12
-0.10
ns
Register Clock Enable Setup Time
-0.11
-0.09
ns
Register Clock Enable Hold Time
0.11
0.13
ns
t
L_GO
t
LL_S
t
LL_H
t
LLPD
Latch Gate to Output Delay
0.10
0.12
ns
Latch Setup Time
0.14
0.16
ns
Latch Hold Time
-0.12
-0.10
ns
Latch Propagation Delay (Transparent Mode)
0.10
0.12
ns
相關(guān)PDF資料
PDF描述
LFX200C-3F900C The ispXPGA architecture
LFX200C-3F900I The ispXPGA architecture
LFX500C-4F900I The ispXPGA architecture
LFX1200C-03F900C Circular Connector; MIL SPEC:MIL-C-26482, Series I; Body Material:Aluminum Alloy; Series:MS3112; No. of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
LFX1200C-03F900I The ispXPGA architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LFX1200B-03F900I 制造商:LATTICE 制造商全稱:Lattice Semiconductor 功能描述:The ispXPGA architecture
LFX1200B-03FE680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200B-03FEN680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 1.25M Gt ispJTAG 2. 5/3.3V -3 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200B-03FEN680C2 功能描述:FPGA - 現(xiàn)場可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200B-04F900C 功能描述:FPGA - 現(xiàn)場可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256