參數(shù)資料
型號： LFX1200B-03F900C
廠商： LATTICE SEMICONDUCTOR CORP
元件分類： FPGA
英文描述： The ispXPGA architecture
中文描述： FPGA, 3844 CLBS, 1250000 GATES, PBGA900
封裝： FPBGA-900
文件頁數(shù)： 16/89頁
文件大小： 941K
代理商： LFX1200B-03F900C
Lattice Semiconductor
ispXPGA Family Data Sheet
16
The second type of interface implemented is the terminated, single-ended interface standard. This group of inter-
faces includes different versions of SSTL and HSTL interfaces along with CTT, and GTL+. Usage of these particu-
lar I/O interfaces requires an additional V
REF
signal. At the system level a termination voltage, V
Typically an output will be terminated to V
TT
at the receiving end of the transmission line it is driving.
TT
, is also required.
The third type of interface standards are the differential standards LVDS, BLVDS, and LVPECL. The differential
standards require two I/O pins to create the differential pair. The logic level is determined by the difference in the
two signals. Table 6 lists how these interface standards are implemented in the ispXPGA devices.
For more information on sysIO capability, refer to Lattice technical note number TN1000,
for Lattice Devices
available at www.latticesemi.com.
sysIO Usage Guidelines
Figure 19. sysIO Banks per Device
Table 4. Number of I/Os per Bank
Device
Max. Number of I/Os per Bank (N)
XPGA 1200
62
XPGA 500
42
XPGA 200
26
XPGA 125
22
GND
V
CCO0
V
REF0
GND
V
CCO1
V
REF1
GND
V
CCO5
V
REF5
GND
V
CCO4
V
REF4
G
V
C
V
R
G
V
C
V
R
G
V
C
V
R
G
I
I
I/O 0
I/O 0
I/O N
I/O N
I/O N
I/O N
I/O 0
I/O 0
I
I
I
I
I
I
V
C
V
R
Bank 3
Bank 2
Bank 6
Bank 7
B
B
B
B
相關(guān)PDF資料
PDF描述
LFX200C-3F900C The ispXPGA architecture
LFX200C-3F900I The ispXPGA architecture
LFX500C-4F900I The ispXPGA architecture
LFX1200C-03F900C Circular Connector; MIL SPEC:MIL-C-26482, Series I; Body Material:Aluminum Alloy; Series:MS3112; No. of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Box Mount Receptacle RoHS Compliant: No
LFX1200C-03F900I The ispXPGA architecture
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LFX1200B-03F900I 制造商:LATTICE 制造商全稱:Lattice Semiconductor 功能描述:The ispXPGA architecture
LFX1200B-03FE680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200B-03FEN680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 1.25M Gt ispJTAG 2. 5/3.3V -3 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200B-03FEN680C2 功能描述:FPGA - 現(xiàn)場可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFX1200B-04F900C 功能描述:FPGA - 現(xiàn)場可編程門陣列 15376 LUT-4 496 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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