voltage, the MPC8240 always performs 3.3-V signaling as described" />
參數(shù)資料
型號： KXPC8240RVV250E
廠商： Freescale Semiconductor
文件頁數(shù)： 35/52頁
文件大?。?/td> 0K
描述： IC MPU INTEGRATED 250MHZ 352TBGA
標(biāo)準(zhǔn)包裝： 2
系列： MPC82xx
處理器類型： 32-位 MPC82xx PowerQUICC II
速度： 250MHz
電壓： 2.5V
安裝類型： 表面貼裝
封裝/外殼： 352-LBGA
供應(yīng)商設(shè)備封裝： 352-TBGA（35x35）
包裝： 托盤
40
MPC8240 Integrated Processor Hardware Specifications
System Design Information
voltage, the MPC8240 always performs 3.3-V signaling as described in the PCI Local Bus Specification,
(Rev 2.1). The MPC8240 only tolerates 5-V signals when interfaced into a 5-V PCI bus system.
1.7.8
Thermal Management Information
This section provides thermal management information for the tape ball grid array (TBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods: adhesive, spring clip to holes in the printed-circuit
board, or package and mounting clip and screw assembly. See Figure 26.
Figure 26. Package Exploded Cross-Sectional View with Several Heat Sink Options
Figure 27 depicts the die junction-to-ambient thermal resistance for four typical cases:
A heat sink is not attached to the TBGA package, and there exists high board-level thermal loading
of adjacent components.
A heat sink is not attached to the TBGA package, and there exists low board-level thermal loading
of adjacent components.
A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA package, and there
exists high board-level thermal loading of adjacent components.
A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA package, and there
exists low board-level thermal loading of adjacent components.
Adhesive or
Thermal Interface
Heat Sink
TBGA Package
Heat Sink
Clip
Printed-Circuit Board
Option
Material
Die
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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KXPC8255CVVIFBC 功能描述:微處理器 - MPU PQ 2 HIP 3 NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KXPC8255CZUIFBC 功能描述:微處理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KXPC8255VVIFBC 功能描述:微處理器 - MPU PQ 2 HIP 3 NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
KXPC8255ZUIFBC 功能描述:微處理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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