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參數(shù)資料
| 型號(hào)： | K7I643684M-FC20 |
| 元件分類： | SRAM |
| 英文描述： | 2M X 36 DDR SRAM, 0.45 ns, PBGA165 |
| 封裝： | 15 X 17 MM, 1 MM PITCH, FBGA-165 |
| 文件頁(yè)數(shù)： | 4/18頁(yè) |
| 文件大?。?/td> | 190K |
| 代理商： | K7I643684M-FC20 |
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2Mx36 & 4Mx18 & 8Mx8 DDRII CIO b4 SRAM
- 12 -
Rev 0.1
Mar. 2003
K7I643684M
K7I641884M
K7I640884M
Preliminary
AC TIMING CHARACTERISTICS(VDD=1.8V
±0.1V, TA=0°C to +70°C)
Notes: 1. All address inputs must meet the specified setup and hold times for all latching clock edges.
2. Control singles are R, W,BW0,BW1 and (NW0, NW1, for x8) and (BW2, BW3, also for x36)
3. If C,C are tied high, K, K become the references for C,C timing parameters.
4. To avoid bus contention, at a given voltage and temperature tCHQX1 is bigger than tCHQZ.
The specs as shown do not imply bus contention beacuse tCHQX1 is a MIN parameter that is worst case at totally different test conditions
(0
°C, 1.9V) than tCHQZ, which is a MAX parameter(worst case at 70°C, 1.7V)
It is not possible for two SRAMs on the same board to be at such different voltage and temperature.
5. Clock phase jitter is the variance from clock rising edge to the next expected clock rising edge.
6. Vdd slew rate must be less than 0.1V DC per 50 ns for DLL lock retention. DLL lock time begins once Vdd and input clock are stable.
7. Echo clock is very tightly controlled to data valid/data hold. By design, there is a
± 0.1ns variation from echo clock to data.
The data sheet parameters reflect tester guardbands and test setup variations.
PARAMETER
SYMBOL
-30
-25
-20
-16
UNITS NOTES
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
Clock
Clock Cycle Time (K, K, C, C)
tKHKH
3.30
4.20
4.00
5.25
5.00
6.30
6.00
7.88
ns
Clock Phase Jitter (K, K, C, C)
tKC var
0.20
ns
5
Clock High Time (K, K , C, C)
tKHKL
1.32
1.60
2.00
2.40
ns
Clock Low Time (K, K, C, C)
tKLKH
1.32
1.60
2.00
2.40
ns
Clock to Clock (K
↑ → K↑, C↑ → C↑)
tKHKH
1.49
1.80
2.20
2.70
ns
Clock to data clock (K
↑ → C↑, K↑→ C↑)
tKHCH
0.00
1.45
0.00
1.80
0.00
2.30
0.00
2.80
ns
DLL Lock Time (K, C)
tKC lock
1024
cycle
6
K Static to DLL reset
tKC reset
30
ns
Output Times
C, C High to Output Valid
tCHQV
0.45
0.50
ns
3
C, C High to Output Hold
tCHQX
-0.45
-0.50
ns
3
C, C High to Echo Clock Valid
tCHCQV
0.45
0.50
ns
C, C High to Echo Clock Hold
tCHCQX
-0.45
-0.50
ns
CQ, CQ High to Output Valid
tCQHQV
0.27
0.30
0.35
0.40
ns
7
CQ, CQ High to Output Hold
tCQHQX
-0.27
-0.30
-0.35
-0.40
ns
7
C, High to Output High-Z
tCHQZ
0.45
0.50
ns
3
C, High to Output Low-Z
tCHQX1
-0.45
-0.50
ns
3
Setup Times
Address valid to K rising edge
tAVKH
0.40
0.50
0.60
0.70
ns
Control inputs valid to K rising edge
tIVKH
0.40
0.50
0.60
0.70
ns
2
Data-in valid to K, K rising edge
tDVKH
0.30
0.35
0.40
0.50
ns
Hold Times
K rising edge to address hold
tKHAX
0.40
0.50
0.60
0.70
ns
K rising edge to control inputs hold
tKHIX
0.40
0.50
0.60
0.70
ns
K, K rising edge to data-in hold
tKHDX
0.30
0.35
0.40
0.50
ns
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| K7I643684M-FC25 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:72Mb DDRII SRAM Specification |
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| K7I643684M-FCI16 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:72Mb DDRII SRAM Specification |
| K7I643684M-FCI20 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:72Mb DDRII SRAM Specification |
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