參數(shù)資料
型號(hào)： ISP1501
英文描述： Hi-Speed Universal Serial Bus peripheral transceiver
中文描述： 高速通用串行總線外設(shè)收發(fā)器
文件頁數(shù)： 40/40頁
文件大?。?/td> 770K
代理商： ISP1501
Koninklijke Philips Electronics N.V. 2002.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 21 November 2002
Document order number: 9397 750 10025
Contents
Philips Semiconductors
ISP1501
Hi-Speed USB peripheral transceiver
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
8
8.1
8.2
8.2.1
8.2.2
8.2.3
8.2.4
8.3
9
10
10.1
10.2
10.3
10.4
10.5
11
11.1
11.2
11.3
12
12.1
12.2
12.3
12.4
13
14
15
16
16.1
16.1.1
16.1.2
17
17.1
17.2
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 7
Full-speed (FS) transceiver . . . . . . . . . . . . . . . 7
High-speed (HS) transceiver—transmit logic . . 8
High-speed (HS) transceiver—receive logic. . . 8
High-speed (HS) transceiver—periphery circuit 9
Operating states. . . . . . . . . . . . . . . . . . . . . . . . . 9
Interface and state selection. . . . . . . . . . . . . . . 9
State transitions . . . . . . . . . . . . . . . . . . . . . . . 10
Disconnect state. . . . . . . . . . . . . . . . . . . . . . . 10
Full-speed (FS) state . . . . . . . . . . . . . . . . . . . 11
High-speed (HS) state . . . . . . . . . . . . . . . . . . 11
High-speed (HS) chirp state . . . . . . . . . . . . . . 11
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Full-speed functionality. . . . . . . . . . . . . . . . . . 13
High-speed functionality. . . . . . . . . . . . . . . . . 14
High-speed transmit . . . . . . . . . . . . . . . . . . . . 14
High-speed receive. . . . . . . . . . . . . . . . . . . . . 16
High-speed chirp . . . . . . . . . . . . . . . . . . . . . . 18
High-speed transmit path delay . . . . . . . . . . . 19
High-speed receive path delay . . . . . . . . . . . . 20
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Power-up behavior . . . . . . . . . . . . . . . . . . . . . 21
Suspend behavior. . . . . . . . . . . . . . . . . . . . . . 21
Reset behavior . . . . . . . . . . . . . . . . . . . . . . . . 21
Termination calibration . . . . . . . . . . . . . . . . . . 22
Power-up behavior . . . . . . . . . . . . . . . . . . . . . 22
Suspend behavior. . . . . . . . . . . . . . . . . . . . . . 22
Reset behavior . . . . . . . . . . . . . . . . . . . . . . . . 22
Mode change behavior. . . . . . . . . . . . . . . . . . 22
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 23
Recommended operating conditions. . . . . . . 23
Static characteristics. . . . . . . . . . . . . . . . . . . . 23
Dynamic characteristics . . . . . . . . . . . . . . . . . 25
High-speed signals. . . . . . . . . . . . . . . . . . . . . 27
Template 1 (transmit waveform) . . . . . . . . . . . 27
Template 4 (receive waveform). . . . . . . . . . . . 28
Parallel digital interface timing. . . . . . . . . . . . 29
High-speed transmit timing. . . . . . . . . . . . . . . 29
High-speed receive timing . . . . . . . . . . . . . . . 30
18
19
20
21
21.1
Application information . . . . . . . . . . . . . . . . . 31
Test information. . . . . . . . . . . . . . . . . . . . . . . . 32
Package outline. . . . . . . . . . . . . . . . . . . . . . . . 33
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Introduction to soldering surface mount
packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 34
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 34
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 35
Package related soldering information. . . . . . 35
Revision history . . . . . . . . . . . . . . . . . . . . . . . 36
Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 39
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
21.2
21.3
21.4
21.5
22
23
24
25
26
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