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參數(shù)資料
| 型號： | IBM13M32734BCC |
| 廠商： | IBM Microeletronics |
| 英文描述： | 32M x 72 2 Bank Registered SDRAM Module(32M x 72 2組寄存同步動態(tài)RAM模塊) |
| 中文描述： | 32M × 72配置2銀行注冊內(nèi)存模塊（32M × 72配置2組寄存同步動態(tài)內(nèi)存模塊） |
| 文件頁數(shù)： | 17/19頁 |
| 文件大?。?/td> | 388K |
| 代理商： | IBM13M32734BCC |
IBM13M32734BCC
Preliminary
32M x 72 2 Bank Registered SDRAM Module
88H5165.E24449
4/98
IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
Page 17 of 19
Layout Drawing: IBM13M32734BCC-360Z, -365Z, and -370Z
R 1.00
.0393
Note:
All dimensions are typical unless otherwise stated.
2.0
.078
.
Detail A
Scale: 4/1
Millimeters
Inches
65.68
2.63
6.35
.250
42.18
1.661
1.27 pitch
.050
1.00 width
.039
See Detail A
133.35
5.25
131.35
5.171
127.35
5.014
(
.
1
Front
8.13
.320 max.
Side
1.273
±
0.10
.050
±
.004
4
Front
Back
4
.
(2) 0
3.1877
.1255
6
1
3.00 min.
.1181.864
.034
13.97
.55
3.1877
.1255
See Detail B
Detail B:
The large circular vias
along the top inch of the DIMM help
transfer heat from the DIMM to the
surrounding air.
4
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