
IBM04184ARLAD
IBM04364ARLAD
128K x 36 & 256K x 18 SRAM
Preliminary
IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
Page 6 of 22
75H4338
Revised 2/99
Clock Truth Table
KZZ
SS
SW
SBWa
SBWb
SBWc
SBWd
DQ (n)
DQ (n+1)
MODE
L
→H
LL
H
X
DOUT 0-35
X
Read Cycle All Bytes
L
→H
LL
L
H
X
DIN 0-8
Write Cycle 1st Byte
L
→H
L
LHLH
H
X
DIN 9-17
Write Cycle 2nd Byte
L
→H
LL
L
H
L
H
X
DIN 18-26
Write Cycle 3rd Byte
L
→H
L
HHH
L
X
DIN 27-35
Write Cycle 4th Byte
L
→H
L
LLLL
L
X
DIN 0-35
Write Cycle All Bytes
L
→H
L
H
High-Z
X
Abort Write Cycle
L
→H
L
H
X
High-Z
X
Deselect Cycle
X
H
X
High-Z
Sleep Mode
Output Enable Truth Table
Operation
GDQ
Read
L
DOUT 0-35
Read
H
High-Z
Sleep (ZZ=H)
X
High-Z
Write (SW=L)
X
High-Z
Deselect (SS=H)
X
High-Z
Absolute Maximum Ratings
Item
Symbol
Rating
Units
Notes
Power Supply Voltage
VDD
-0.5 to 3.9
V
Output Power Supply Voltage
VDDQ
VDD
Input Voltage
VIN
-0.5 to VDD+0.5
Output Voltage
VOUT
-0.5 to VDD+0.5
Operating Temperature
TJ
0 to +110
°C
Storage Temperature
TSTG
-55 to +125
°C
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reli-
ability.
PBGA Thermal Characteristics
Item
Symbol
Rating
Units
Thermal Resistance Junction to Case
R
ΘJC
1
°C/W