參數(shù)資料
型號(hào)： HYS64T16000HDL-2.5-A
廠商： INFINEON TECHNOLOGIES AG
元件分類： DRAM
英文描述： 16M X 64 DDR DRAM MODULE, 0.4 ns, DMA200
封裝： GREEN, SODIMM-200
文件頁(yè)數(shù)： 10/46頁(yè)
文件大小： 833K
代理商： HYS64T16000HDL-2.5-A
HYS64T[16/32/64]0xxxHDL–[2.5/3.7/5]–A
Small Outline DDR2 SDRAM Modules
Electrical Characteristics
Data Sheet
15
Rev. 1.1, 2005-06
02182004-HWZ1-64OM
3
Electrical Characteristics
3.1
Absolute Maximum Ratings
3.2
DC Operating Conditions
Table 9
Absolute Maximum Ratings
Parameter
Symbol
Values
Unit
Note/Test
Condition
Min.
Max.
Voltage on any pins relative to
V
SS
V
IN, VOUT
– 0.5
2.3
V
1)
1) Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only, and device
functional operation at or above the conditions indicated is not implied. Exposure to absolute maximum rating conditions
for extended periods may affect reliability
Voltage on
V
DD relative to VSS
V
DD
– 1.0
2.3
V
Voltage on
V
DDQ relative to VSS
V
DDQ
– 0.5
2.3
V
Storage Humidity (without condensation)
H
STG
595
%
Table 10
Operating Conditions
Parameter
Symbol
Values
Unit
Note
Min.
Max.
Operating temperature (ambient)
T
OPR
0+65
°C
DRAM Case Temperature
T
CASE
0+95
°C
1)2)3)4)
1) DRAM Component Case Temperature is the surface temperature in the center on the top side of any of the DRAMs.
2) Within the DRAM Component Case Temperature Range all DRAM specifications will be supported
3) Above 85 °C DRAM Case Temperature the Auto-Refresh command interval has to be reduced to
t
REFI = 3.9 s
4) Self-Refresh period is hard-coded in the DRAMs and therefore it is imperative that the system ensures the DRAM is below
85 °C Case Temperature before initiating Self-Refresh operation.
Storage Temperature
T
STG
– 50
+100
°C
Barometric Pressure (operating & storage)
69
105
kPa
5)
5) Up to 3000 m.
Operating Humidity (relative)
H
OPR
10
90
%
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