參數(shù)資料
型號: HYE25L256160AC
廠商: INFINEON TECHNOLOGIES AG
英文描述: 256-Mbit Mobile-RAM
中文描述: 256兆移動RAM
文件頁數(shù): 5/55頁
文件大?。?/td> 1053K
代理商: HYE25L256160AC
Data Sheet
5
V1.1, 2003-04-16
HYE25L256160AC
256-Mbit Mobile-RAM
Overview
interleave fashion allows random access operation to occur at higher rate. A sequential and gapless data rate is
possible depending on burst length, CAS latency and speed grade of the device.
The Mobile-RAM is housed in a FBGA “chip-size” package. The Mobile-RAM is available in the extended (–25 °C
to +85 °C) temperature range.
Table 2
Part Number
1)
HYE25L256160AC–7.5
HYE25L256160AC–8
Ordering Information
1) HYB/E: designator for memory components for commercial/extended temperature range
25L:
Mobile-RAM
at
V
DD
= 2.5 V
256: 256-Mbit density
160: Product variation x16
A: Die revision A
C: Package type FBGA
7.5/8: speed grade - see
Table 1
Function Code
PC133–333–522
PC100–222–620
Case Temperature Range
extended (–25 °C to +85 °C)
Package
P-TFBGA-54
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