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| 型號(hào)： | HD64F2623 |
| 英文描述： | H8S/2623F-ZTAT.On-Chip HCAN Application Notes/Q&A |
| 中文描述： | H8S/2623F-ZTAT.On-Chip HCAN應(yīng)用筆記/ Q首頁(yè) |
| 文件頁(yè)數(shù)： | 50/67頁(yè) |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2623 |
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Rev. 2.0, 03/06/02, 45
3.3.2
Build File Phase Order
If you were to select a C source file from the “Workspace” window and then activate [Build->Build File] (or
press
) you would expect the file to be compiled. Likewise, if you were to select an assembly source file from
the workspace window and then activate [Build->Build File] you would expect the file to be assembled. The
connection between file group and which phase(s) to execute is managed by the “Build File Order” tab of the
“Build Phases” dialog (figure 3.9).
Figure 3.9: Build Phases Dialog Build File Order Tab
The list displays all of the current phases that will be executed when the build file operation is selected upon the
file group shown in the “File group” list box. In figure 3.9 the “C source file” file group is selected and the
“Compiler” and “MyPhase” phases are associated with it.
Entries in the “Phase order” list, of the “Build File Order” tab, are added automatically as new entries are added
to the “Build Order” tab. For example, if you were to add a phase which takes C source files as input then this
phase will be automatically added to the list of phases to execute when a build file operation is applied to a C
source file. If you don’t want a certain phase to execute when [Build->Build File] is selected then clear the
check box to the left of the phase name in the “Phase order” list.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2623FA20 | 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2623FA20J | 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2623FA20J/AU | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2623FA20JV | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2623FA20V | 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 256KB Flash 3.3V/5V 100-Pin PQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V/5V 100PQFP - Trays 制造商:Renesas Electronics 功能描述:H8S 20MHz |
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