參數(shù)資料
型號(hào)： HD64F2623
英文描述： H8S/2623F-ZTAT.On-Chip HCAN Application Notes/Q&A
中文描述： H8S/2623F-ZTAT.On-Chip HCAN應(yīng)用筆記/ Q首頁
文件頁數(shù)： 32/67頁
文件大?。?/td> 382K
代理商： HD64F2623
Rev. 2.0, 03/06/02, 29
2.7
File Dependencies
A typical project will contain dependencies between files, for example, one C file may “#include” one or more
header files. In complex projects, source files will include (or depend upon) others and this can quickly become
difficult to manage. However, the HEW provides a dependency scanning mechanism whereby all files in a
project are checked for dependencies. Once complete, the project window will display an up-to-date list with all
the project file dependencies.
To update a project’s dependencies:
Select [Build->Update All Dependencies] or click the right mouse button on a project icon in the “Projects”
tab of the “Workspace” window and select [Update All Dependencies] from the pop-up menu.
Initially, the dependencies for all files are contained within the “Dependencies” folder (figure 2.20.i).
2.8
Configuring the Workspace Window
If you click the right mouse button anywhere inside the “Projects” tab of the “Workspace” window, a pop-up
menu will be invoked. Select the “Configure View…” menu option to modify the way in which information is
displayed. The following four sections detail the effect of each option on the “Configure View” dialog.
2.8.1
Show Dependencies under Each File
If you select “Show dependencies under each file”, the dependent files are shown under the including source file
as a flat structure, i.e. the files themselves become folders (figure 2.20.ii). If this option is not selected then a
separate folder contains all dependencies (figure 2.20.i).
Figure 2.20: Dependencies under Each File
相關(guān)PDF資料
PDF描述
HD64F2626 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2633 H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool
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HD64F2633F16I Microcontroller
HD64F2633F25 Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2623FA20 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J/AU 制造商:Renesas Electronics Corporation 功能描述:
HD64F2623FA20JV 制造商:Renesas Electronics Corporation 功能描述:
HD64F2623FA20V 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 256KB Flash 3.3V/5V 100-Pin PQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V/5V 100PQFP - Trays 制造商:Renesas Electronics 功能描述:H8S 20MHz
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