參數(shù)資料
型號(hào): HD64F2623
英文描述: H8S/2623F-ZTAT.On-Chip HCAN Application Notes/Q&A
中文描述: H8S/2623F-ZTAT.On-Chip HCAN應(yīng)用筆記/ Q首頁(yè)
文件頁(yè)數(shù): 42/67頁(yè)
文件大小: 382K
代理商: HD64F2623
Rev. 2.0, 03/06/02, 38
3.2
Creating a Custom Build Phase
If you want to execute another tool before, during or after a standard build process then this can be achieved by
creating your own (i.e. custom) build phase.
Select [Options->Build Phases…] to invoke the “Build Phases” dialog (figure 3.2) and then click the “Add…”
button. This will invoke the new build phase wizard dialog (figure 3.3a).
The first step (as shown in figure 3.3a) asks whether you want to create an entirely new phase or whether you
want to add a system phase. A system phase is a “ready made” phase which is already defined within the
toolchain you are using (e.g. compiler, assembler, linker, librarian, etc.) or a utility phase (e.g. file copy,
complexity analyzer etc.).
The “Add an existing system phase” button is inactive if no more system phases are available. Select the “Create
a new custom phase” button to create your own build phase.
Figure 3.3a: New Build Phase Dialog (Step 1)
相關(guān)PDF資料
PDF描述
HD64F2626 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2633 H8S.H8/300 Series Simulator/Debugger User's Manual/Cross tool
HD64F2633F16 Microcontroller
HD64F2633F16I Microcontroller
HD64F2633F25 Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2623FA20 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI,I²C,LIN,SPI,UART/USART 外圍設(shè)備:電容感應(yīng),DMA,LCD,POR,PWM,WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB(64K x 8) 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b,D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI,I²C,LIN,SPI,UART/USART 外圍設(shè)備:電容感應(yīng),DMA,LCD,POR,PWM,WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB(64K x 8) 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b,D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J/AU 制造商:Renesas Electronics Corporation 功能描述:
HD64F2623FA20JV 制造商:Renesas Electronics Corporation 功能描述:
HD64F2623FA20V 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 256KB Flash 3.3V/5V 100-Pin PQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V/5V 100PQFP - Trays 制造商:Renesas Electronics 功能描述:H8S 20MHz