參數(shù)資料
型號(hào)： HD64F2623
英文描述： H8S/2623F-ZTAT.On-Chip HCAN Application Notes/Q&A
中文描述： H8S/2623F-ZTAT.On-Chip HCAN應(yīng)用筆記/ Q首頁(yè)
文件頁(yè)數(shù)： 31/67頁(yè)
文件大?。?/td> 382K
代理商： HD64F2623
Rev. 2.0, 03/06/02, 28
2.6.5
The Output Window
When a tool executes (i.e. compiler, assembler, linker etc.) its output is displayed in the “Output” window. If any
of the tools produce any errors or warnings then they are displayed along with the source file name and the line
number at which the error is located. To quickly locate a specific bug, double click on a given error/warning to
invoke the current editor.
2.6.6
Controlling the Content of the Output Window
It is often useful to display low-level information (such as the command line options that are being applied to a
file) during a build. The HEW allows you to specify whether or not you want such options displayed in the
“Output” window during a build, build all or build file operation via the “Tools Options” dialog.
To view or hide extra information during a build:
1. Select [Tools->Options...]. The “Options” dialog will be displayed.
2. Select the “Build” tab (figure 2.19).
3. Set the three check boxes in the “Show” group as follows. “Command line” controls whether the
command line is shown as each tool is executed. “Environment” controls whether the environment is
shown as each tool is executed. “Initial directory” controls whether the current directory is shown as each
tool is executed.
Figure 2.19: Options Dialog Build Tab
相關(guān)PDF資料
PDF描述
HD64F2626 Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool
HD64F2633 H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool
HD64F2633F16 Microcontroller
HD64F2633F16I Microcontroller
HD64F2633F25 Microcontroller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HD64F2623FA20 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲(chǔ)器容量:64KB（64K x 8） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤
HD64F2623FA20J/AU 制造商:Renesas Electronics Corporation 功能描述:
HD64F2623FA20JV 制造商:Renesas Electronics Corporation 功能描述:
HD64F2623FA20V 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 256KB Flash 3.3V/5V 100-Pin PQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V/5V 100PQFP - Trays 制造商:Renesas Electronics 功能描述:H8S 20MHz
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