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| 型號： | HD64F2623 |
| 英文描述： | H8S/2623F-ZTAT.On-Chip HCAN Application Notes/Q&A |
| 中文描述： | H8S/2623F-ZTAT.On-Chip HCAN應(yīng)用筆記/ Q首頁 |
| 文件頁數(shù)： | 2/67頁 |
| 文件大?。?/td> | 382K |
| 代理商： | HD64F2623 |
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Rev. 2.0, 03/06/02, 1
1.
Overview
This chapter describes the fundamental concepts of the Hitachi Embedded Workshop. It is intended to give users
who are new to Windows extra help, filling in the details that are required by later chapters.
1.1
Workspaces, Projects and Files
Just as a word processor allows you to create and modify documents, the Hitachi Embedded Workshop allows
you to create and modify workspaces. A workspace can be thought of as a container of projects and, similarly, a
project can be though of as a container of project files. Thus, each workspace contains one or more projects and
each project contains one or more files. Figure 1.1 illustrates this graphically.
PROJECT
FILE
WORKSPACE
Figure 1.1: Workspaces, Projects and Files
Workspaces allow you to group related projects together. For example, you may have an application that needs
to be built for different processors or you may be developing an application and library at the same time. Projects
can also be linked hierarchically within a workspace, which means that when one project is built all of its “child”
projects are built first.
However, workspaces on their own are not very useful, we need to add a project to a workspace and then add
files to that project before we can actually do anything.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HD64F2626 | Microcomputer Development Environment System High-Performance Embedded Workshop 2 HEW Builder Users Manual/Cross tool |
| HD64F2633 | H8S.H8/300 Series Simulator/Debugger User＇s Manual/Cross tool |
| HD64F2633F16 | Microcontroller |
| HD64F2633F16I | Microcontroller |
| HD64F2633F25 | Microcontroller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HD64F2623FA20 | 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2623FA20J | 功能描述:IC H8S MCU FLASH 256K 100-QFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:H8® H8S/2600 標(biāo)準(zhǔn)包裝:60 系列:PSOC® 3 CY8C38xx 核心處理器:8051 芯體尺寸:8-位 速度:67MHz 連通性:EBI/EMI，I²C，LIN，SPI，UART/USART 外圍設(shè)備:電容感應(yīng)，DMA，LCD，POR，PWM，WDT 輸入/輸出數(shù):25 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:2K x 8 RAM 容量:8K x 8 電壓 - 電源 (Vcc/Vdd):1.71 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 2x20b，D/A 4x8b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFQFN 裸露焊盤 包裝:托盤 |
| HD64F2623FA20J/AU | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2623FA20JV | 制造商:Renesas Electronics Corporation 功能描述: |
| HD64F2623FA20V | 制造商:Renesas Electronics Corporation 功能描述:MCU 16-bit H8S CISC 256KB Flash 3.3V/5V 100-Pin PQFP 制造商:Renesas Electronics Corporation 功能描述:MCU 16BIT/32BIT H8S CISC 256KB FLASH 3.3V/5V 100PQFP - Trays 制造商:Renesas Electronics 功能描述:H8S 20MHz |
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