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參數(shù)資料
| 型號： | GS8662R09BGD-400I |
| 廠商： | GSI TECHNOLOGY |
| 元件分類： | SRAM |
| 英文描述： | 8M X 9 STANDARD SRAM, 0.45 ns, PBGA165 |
| 封裝： | 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 |
| 文件頁數(shù)： | 28/37頁 |
| 文件大?。?/td> | 769K |
| 代理商： | GS8662R09BGD-400I |
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GS8662R08/09/18/36BD-400/350/333/300/250
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.02 3/2011
34/37
2011, GSI Technology
Ordering Information—GSI SigmaDDR-II SRAM
Org
Part Number1
Type
Package
Speed (MHz)
TJ2
8M x 8
GS8662R08BD-400
SigmaDDR-II B4 SRAM
165-bump BGA
400
C
8M x 8
GS8662R08BD-350
SigmaDDR-II B4 SRAM
165-bump BGA
350
C
8M x 8
GS8662R08BD-333
SigmaDDR-II B4 SRAM
165-bump BGA
333
C
8M x 8
GS8662R08BD-300
SigmaDDR-II B4 SRAM
165-bump BGA
300
C
8M x 8
GS8662R08BD-250
SigmaDDR-II B4 SRAM
165-bump BGA
250
C
8M x 8
GS8662R08BD-400I
SigmaDDR-II B4 SRAM
165-bump BGA
400
I
8M x 8
GS8662R08BD-350I
SigmaDDR-II B4 SRAM
165-bump BGA
350
I
8M x 8
GS8662R08BD-333I
SigmaDDR-II B4 SRAM
165-bump BGA
333
I
8M x 8
GS8662R08BD-300I
SigmaDDR-II B4 SRAM
165-bump BGA
300
I
8M x 8
GS8662R08BD-250I
SigmaDDR-II B4 SRAM
165-bump BGA
250
I
8M x 9
GS8662R09BD-400
SigmaDDR-II B4 SRAM
165-bump BGA
400
C
8M x 9
GS8662R09BD-350
SigmaDDR-II B4 SRAM
165-bump BGA
350
C
8M x 9
GS8662R09BD-333
SigmaDDR-II B4 SRAM
165-bump BGA
333
C
8M x 9
GS8662R09BD-300
SigmaDDR-II B4 SRAM
165-bump BGA
300
C
8M x 9
GS8662R09BD-250
SigmaDDR-II B4 SRAM
165-bump BGA
250
C
8M x 9
GS8662R09BD-400I
SigmaDDR-II B4 SRAM
165-bump BGA
400
I
8M x 9
GS8662R09BD-350I
SigmaDDR-II B4 SRAM
165-bump BGA
350
I
8M x 9
GS8662R09BD-333I
SigmaDDR-II B4 SRAM
165-bump BGA
333
I
8M x 9
GS8662R09BD-300I
SigmaDDR-II B4 SRAM
165-bump BGA
300
I
8M x 9
GS8662R09BD-250I
SigmaDDR-II B4 SRAM
165-bump BGA
250
I
4M x 18
GS8662R18BD-400
SigmaDDR-II B4 SRAM
165-bump BGA
400
C
4M x 18
GS8662R18BD-350
SigmaDDR-II B4 SRAM
165-bump BGA
350
C
4M x 18
GS8662R18BD-333
SigmaDDR-II B4 SRAM
165-bump BGA
333
C
4M x 18
GS8662R18BD-300
SigmaDDR-II B4 SRAM
165-bump BGA
300
C
4M x 18
GS8662R18BD-250
SigmaDDR-II B4 SRAM
165-bump BGA
250
C
4M x 18
GS8662R18BD-400I
SigmaDDR-II B4 SRAM
165-bump BGA
400
I
4M x 18
GS8662R18BD-350I
SigmaDDR-II B4 SRAM
165-bump BGA
350
I
4M x 18
GS8662R18BD-333I
SigmaDDR-II B4 SRAM
165-bump BGA
333
I
4M x 18
GS8662R18BD-300I
SigmaDDR-II B4 SRAM
165-bump BGA
300
I
4M x 18
GS8662R18BD-250I
SigmaDDR-II B4 SRAM
165-bump BGA
250
I
2M x 36
GS8662R36BD-400
SigmaDDR-II B4 SRAM
165-bump BGA
400
C
2M x 36
GS8662R36BD-350
SigmaDDR-II B4 SRAM
165-bump BGA
350
C
Notes:
1. For Tape and Reel add the character “T” to the end of the part number. Example: GS8662Rx36BD-300T.
2. C = Commercial Temperature Range. I = Industrial Temperature Range.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| GS8662R09E-167 | 制造商:GSI 制造商全稱:GSI Technology 功能描述:72Mb SigmaCIO DDR-II Burst of 4 SRAM |
| GS8662R09E-167I | 制造商:GSI 制造商全稱:GSI Technology 功能描述:72Mb SigmaCIO DDR-II Burst of 4 SRAM |
| GS8662R09E-200 | 制造商:GSI 制造商全稱:GSI Technology 功能描述:72Mb SigmaCIO DDR-II Burst of 4 SRAM |
| GS8662R09E-200I | 制造商:GSI 制造商全稱:GSI Technology 功能描述:72Mb SigmaCIO DDR-II Burst of 4 SRAM |
| GS8662R09E-250 | 制造商:GSI 制造商全稱:GSI Technology 功能描述:72Mb SigmaCIO DDR-II Burst of 4 SRAM |
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