參數(shù)資料
型號(hào): FX579
英文描述: Half Duplex GMSK Modem
中文描述: 半雙工GMSK調(diào)制解調(diào)器
文件頁(yè)數(shù): 23/23頁(yè)
文件大小: 582K
代理商: FX579
Half Duplex GMSK Modem
FX579
Handling precautions: This product includes input protection, however, precautions should be taken to prevent
device damage from electro-static discharge. CML does not assume any responsibility for the use of any
circuitry described. No IPR or circuit patent licences are implied. CML reserves the right at any time without
notice to change the said circuitry and this product specification. CML has a policy of testing every product
shipped using calibrated test equipment to ensure compliance with this product specification. Specific testing
of all circuit parameters is not necessarily performed.
CONSUMER MICROCIRCUITS LIMITED
1 WHEATON ROAD
WITHAM - ESSEX CM8 3TD - ENGLAND
Telephone:
Telefax:
+44 1376 513833
+44 1376 518247
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
FX579D4 制造商:CMLMICRO 制造商全稱(chēng):CML Microcircuits 功能描述:HALF DUPLEX GMSK MODEM
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FX5-80P-SH 功能描述:CONN HEADER 80POS 1MM R/A GOLD RoHS:否 類(lèi)別:連接器,互連式 >> 板對(duì)板 - 陣列,邊緣類(lèi)型,包廂 系列:FX5 標(biāo)準(zhǔn)包裝:3,000 系列:SlimStack™ 502396 連接器類(lèi)型:插頭,外罩觸點(diǎn) 位置數(shù):100 間距:0.016"(0.40mm) 行數(shù):2 安裝類(lèi)型:表面貼裝 特點(diǎn):固定焊尾 觸點(diǎn)表面涂層:金 觸點(diǎn)涂層厚度:8µin(0.20µm) 包裝:帶卷 (TR) 配接層疊高度:2.5mm 板上方高度:0.084"(2.13mm) 其它名稱(chēng):502396-1010
FX5-80P-SH(71) 功能描述:板對(duì)板與夾層連接器 HDR 80P 1MM R/A GOLD RoHS:否 制造商:JAE Electronics 系列:WP3 產(chǎn)品類(lèi)型:Receptacles 節(jié)距:0.4 mm 疊放高度:1 mm 安裝角: 位置/觸點(diǎn)數(shù)量:50 排數(shù):2 外殼材料:Plastic 觸點(diǎn)材料:Copper Alloy 觸點(diǎn)電鍍:Gold 電壓額定值:50 V 電流額定值:0.4 A
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