參數(shù)資料
型號： EPF10K100BFC256-2DX
英文描述： ASIC
中文描述： 專用集成電路
文件頁數(shù)： 63/120頁
文件大?。?/td> 1901K
代理商： EPF10K100BFC256-2DX
Altera Corporation
47
FLEX 10KE Embedded Programmable Logic Family Data Sheet
Generic Testing
Each FLEX 10KE device is functionally tested. Complete testing of each
configurable static random access memory (SRAM) bit and all logic
functionality ensures 100% yield. AC test measurements for FLEX 10KE
devices are made under conditions equivalent to those shown in
Figure 21. Multiple test patterns can be used to configure devices during
all stages of the production flow.
Figure 21. FLEX 10KE AC Test Conditions
Operating
Conditions
Tables 19 through 23 provide information on absolute maximum ratings,
recommended operating conditions, DC operating conditions, and
capacitance for 2.5-V FLEX 10KE devices.
Test
System
C1 (includes
JIG capacitance)
Device input
rise and fall
times < 3 ns
Device
Output
703
8.06 k
[481
]
[481
]
VCCIO
Power supply transients can affect AC
measurements. Simultaneous transitions of
multiple outputs should be avoided for
accurate measurement. Threshold tests
must not be performed under AC
conditions. Large-amplitude, fast-
ground-current transients normally
occur as the device outputs discharge
the load capacitances. When these
transients ow through the parasitic
inductance between the device ground
pin and the test system ground,
signicant reductions in observable
noise immunity can result. Numbers in
brackets are for 2.5-V devices or outputs.
Numbers without brackets are for 3.3-V
Table 19. FLEX 10KE 2.5-V Device Absolute Maximum Ratings
Symbol
Parameter
Conditions
Min
Max
Unit
VCCINT
Supply voltage
With respect to ground (2)
–0.5
3.6
V
VCCIO
–0.5
4.6
V
VI
DC input voltage
–2.0
5.75
V
IOUT
DC output current, per pin
–25
25
mA
TSTG
Storage temperature
No bias
–65
150
° C
TAMB
Ambient temperature
Under bias
–65
135
° C
TJ
Junction temperature
PQFP, TQFP, BGA and FineLine BGA
packages, under bias
135
° C
Ceramic PGA packages, under bias
150
° C
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