- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄1917 > DSPB56367AG150 (Freescale Semiconductor)IC DSP 24BIT 150MHZ 144-LQFP PDF資料下載
參數(shù)資料
| 型號(hào)： | DSPB56367AG150 |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 88/100頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DSP 24BIT 150MHZ 144-LQFP |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 系列： | DSP56K/Symphony |
| 類型： | 音頻處理器 |
| 接口： | 主機(jī)接口，I²C，SAI，SPI |
| 時(shí)鐘速率： | 150MHz |
| 非易失內(nèi)存： | ROM（240 kB） |
| 芯片上RAM： | 69kB |
| 電壓 - 輸入/輸出： | 3.30V |
| 電壓 - 核心： | 1.80V |
| 工作溫度： | -40°C ~ 95°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 144-LQFP |
| 供應(yīng)商設(shè)備封裝： | 144-LQFP（20x20） |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁當(dāng)前第88頁第89頁第90頁第91頁第92頁第93頁第94頁第95頁第96頁第97頁第98頁第99頁第100頁
Electrical Design Considerations
DSP56367 Technical Data, Rev. 2.1
5-2
Freescale Semiconductor
To minimize temperature variation across the surface, the thermal resistance is measured from the
junction to the outside surface of the package (case) closest to the chip mounting area when that
surface has a proper heat sink.
To define a value approximately equal to a junction-to-board thermal resistance, the thermal
resistance is measured from the junction to where the leads are attached to the case.
If the temperature of the package case (TT) is determined by a thermocouple, the thermal resistance
is computed using the value obtained by the equation: (TJ – TT)/PD.
As noted above, the junction-to-case thermal resistances quoted in this data sheet are determined using the
first definition. From a practical standpoint, that value is also suitable for determining the junction
temperature from a case thermocouple reading in forced convection environments. In natural convection,
using the junction-to-case thermal resistance to estimate junction temperature from a thermocouple
reading on the case of the package will estimate a junction temperature slightly hotter than actual
temperature. Hence, the new thermal metric, thermal characterization parameter or
Ψ
JT, has been defined
to be (TJ – TT)/PD. This value gives a better estimate of the junction temperature in natural convection
when using the surface temperature of the package. Remember that surface temperature readings of
packages are subject to significant errors caused by inadequate attachment of the sensor to the surface and
to errors caused by heat loss to the sensor. The recommended technique is to attach a 40-gauge
thermocouple wire and bead to the top center of the package with thermally conductive epoxy.
5.2
Electrical Design Considerations
CAUTION
This device contains circuitry protecting against damage due to high static
voltage or electrical fields. However, normal precautions should be taken to
avoid exceeding maximum voltage ratings. Reliability of operation is
enhanced if unused inputs are tied to an appropriate logic voltage level (e.g.,
either GND or VCC). The suggested value for a pull-up or pull-down resistor
is 10 k ohm.
Use the following list of recommendations to assure correct DSP operation:
Provide a low-impedance path from the board power supply to each VCC pin on the DSP and from
the board ground to each GND pin.
Use at least six 0.01–0.1
F bypass capacitors positioned as close as possible to the four sides of
the package to connect the VCC power source to GND.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VCC and
GND pins are less than 1.2 cm (0.5 inch) per capacitor lead.
Use at least a four-layer PCB with two inner layers for VCC and GND.
Because the DSP output signals have fast rise and fall times, PCB trace lengths should be minimal.
This recommendation particularly applies to the address and data buses as well as the IRQA,
IRQB, IRQD, and TA pins. Maximum PCB trace lengths on the order of 15 cm (6 inches) are
recommended.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DSPB56371AF180 | IC DSP 24BIT 180MHZ 80-LQFP |
| DSPB56374AEC | IC DSP 24BIT 150MHZ 52-LQFP |
| DSPB56720CAG | DSP 24BIT AUD 200MHZ 144-LQFP |
| DSPB56724AG | DSP 24BIT AUD 250MHZ 144-LQFP |
| DSPIC30F2010T-20E/MM | IC DSPIC MCU/DSP 12K 28QFN |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DSPB56367PV150 | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 150Mhz/ 150MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| DSPB5636AG120 | 制造商:Freescale Semiconductor 功能描述: |
| DSPB56371AF150 | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 150 MHZ VERSION DSPB371 RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| DSPB56371AF180 | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC BLANK ROM VERSION 56371 RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| DSPB56371AF180 | 制造商:Freescale Semiconductor 功能描述:Digital Signal Processor (DSP) IC |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。