參數(shù)資料
型號(hào)： DSP56311VL150R2
廠商： Freescale Semiconductor
文件頁數(shù)： 69/96頁
文件大小： 0K
描述： IC DSP 24BIT 150MHZ 196-MAPBGA
標(biāo)準(zhǔn)包裝： 1
系列： DSP56K/Symphony
類型： 定點(diǎn)
接口： 主機(jī)接口，SSI，SCI
時(shí)鐘速率： 150MHz
非易失內(nèi)存： ROM（576 B）
芯片上RAM： 384kB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 1.80V
工作溫度： -40°C ~ 100°C
安裝類型： 表面貼裝
封裝/外殼： 196-LBGA
供應(yīng)商設(shè)備封裝： 196-MAPBGA（15x15）
包裝： 剪切帶 (CT)
其它名稱： DSP56311VL150R2CT
DSP56311 Technical Data, Rev. 8
Freescale Semiconductor
4-1
Design Considerations
4
This section describes various areas to consider when incorporating the DSP56311 device into a system design.
4.1 Thermal Design Considerations
An estimate of the chip junction temperature, TJ, in ° C can be obtained from this equation:
Equation 1:
Where:
TA
=
ambient temperature °C
RθJA
=
package junction-to-ambient thermal resistance °C/W
PD
=
power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and a case-
to-ambient thermal resistance, as in this equation:
Equation 2:
Where:
RθJA
=
package junction-to-ambient thermal resistance °C/W
RθJC
=
package junction-to-case thermal resistance °C/W
RθCA
=
package case-to-ambient thermal resistance °C/W
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change
the case-to-ambient thermal resistance, RθCA. For example, the user can change the air flow around the device, add
a heat sink, change the mounting arrangement on the printed circuit board (PCB) or otherwise change the thermal
dissipation capability of the area surrounding the device on a PCB. This model is most useful for ceramic packages
with heat sinks; some 90 percent of the heat flow is dissipated through the case to the heat sink and out to the
ambient environment. For ceramic packages, in situations where the heat flow is split between a path to the case
and an alternate path through the PCB, analysis of the device thermal performance may need the additional
modeling capability of a system-level thermal simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the
package is mounted. Again, if the estimates obtained from RθJA do not satisfactorily answer whether the thermal
performance is adequate, a system-level model may be appropriate.
A complicating factor is the existence of three common ways to determine the junction-to-case thermal resistance
in plastic packages.
T
J
T
A
P
D
RθJA
×
()
+
=
RθJA
RθJC RθCA
+
=
相關(guān)PDF資料
PDF描述
ASM30DRSH-S288 CONN EDGECARD 60POS .156 EXTEND
T491X107K016AH CAP TANT 100UF 16V 10% 2917
UBA2015AP/1,112 IC LAMP DVR FLUORES 600V 20-DIP
DS1621S+T&R IC THERMOMETER/STAT DIG 8-SOIC
VI-B6Y-CX-F3 CONVERTER MOD DC/DC 3.3V 49.5W
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DSP56311VL160 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 24 BIT DSP PBFREE RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSP56321 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:24-Bit Digital Signal Processor
DSP56321EVM 功能描述:開發(fā)板和工具包 - 其他處理器 DSP56321EVM RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
DSP56321EVMUM 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DSP56321 EVM User＇s Manual
DSP56321FC200 制造商:Freescale Semiconductor 功能描述:HIP7 56321 200MHZ DSP - Trays
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*