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參數(shù)資料
| 型號(hào)： | CYV15G0204RB |
| 廠商： | Cypress Semiconductor Corp. |
| 英文描述： | Independent Clock Dual HOTLink II⑩ Reclocking Deserializer |
| 中文描述： | 獨(dú)立時(shí)鐘雙的HOTLink二⑩時(shí)鐘重計(jì)解串器 |
| 文件頁數(shù)： | 23/24頁 |
| 文件大?。?/td> | 332K |
| 代理商： | CYV15G0204RB |
CYV15G0204RB
Document #: 38-02103 Rev. *C
Page 23 of 24
Cypress Semiconductor Corporation, 2002-2007. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the
use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to
be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Ordering Information
HOTLink is a registered trademark and HOTLink II and MultiFrame are trademarks of Cypress Semiconductor. All product and
company names mentioned in this document may be the trademarks of their respective holders.
Speed
Ordering Code
Package
Name
BL256
BL256
Package Type
Operating
Range
Commercial
Commercial
Standard
Standard
CYV15G0204RB-BGC
CYV15G0204RB-BGXC
256-Ball Thermally Enhanced Ball Grid Array
Pb-Free 256-Ball Thermally Enhanced Ball Grid Array
Package Diagram
Figure 3. 256-Lead L2 Ball Grid Array (27 x 27 x 1.57 mm) BL256
A
B
0.15
C
0.15
C
0.97 REF.
0.60±0.10
1.57±0.175
C
0.20 MIN
TOP OF MOLD COMPOUND
TO TOP OF BALLS
SEATING PLANE
SIDE VIEW
SECTION A-A
TOP VIEW
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
A
0.15 M C
0.30 M C
0.75±0.15(256X)
B
A
1
BOTTOM VIEW (BALL SIDE)
A
0.20(4X)
26°
TYP
A1 CORNER I.D.
0.50 MIN.
2
27.00±0.13
2
24.13
A1 CORNER I.D.
R 2.5 Max (4X)
1
51-85123-*E
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相關(guān)PDF資料 |
PDF描述 |
|---|---|
| CYV15G0204RB-BGC | Independent Clock Dual HOTLink II⑩ Reclocking Deserializer |
| CYV15G0204RB-BGXC | Independent Clock Dual HOTLink II⑩ Reclocking Deserializer |
| CYV15G0204TRB | Independent Clock HOTLink II⑩ Dual Serializer and Dual Reclocking Deserializer |
| CYV15G0204TRB-BGC | Independent Clock HOTLink II⑩ Dual Serializer and Dual Reclocking Deserializer |
| CYV15G0204TRB-BGXC | Independent Clock HOTLink II⑩ Dual Serializer and Dual Reclocking Deserializer |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| CYV15G0204RB_09 | 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:Independent Clock Dual HOTLink II Reclocking Deserializer |
| CYV15G0204RB-BGC | 功能描述:視頻 IC 2x Indep Reclockers COM RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel |
| CYV15G0204RB-BGXC | 功能描述:IC DESERIAL HOTLINK 256LBGA RoHS:是 類別:集成電路 (IC) >> 接口 - 串行器，解串行器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 功能:解串器 數(shù)據(jù)速率:2.5Gbps 輸入類型:串行 輸出類型:并聯(lián) 輸入數(shù):- 輸出數(shù):24 電源電壓:1.8 V ~ 3.3 V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:64-TQFP 裸露焊盤 供應(yīng)商設(shè)備封裝:64-TQFP-EP（10x10） 包裝:管件 |
| CYV15G0204TRB | 制造商:CYPRESS 制造商全稱:Cypress Semiconductor 功能描述:Independent Clock HOTLink II⑩ Dual Serializer and Dual Reclocking Deserializer |
| CYV15G0204TRB-BGC | 功能描述:視頻 IC 2x Indep Reclocker Serializer COM RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel |
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