參數(shù)資料
型號: CY7C1464AV25
廠商: Cypress Semiconductor Corp.
英文描述: 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL Architecture(帶NoBL結構的36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM)
中文描述: 36兆位(1米x 36/2M x 18/512K × 72)流水線的SRAM架構的總線延遲(帶總線延遲結構的36兆位(1米x 36/2M x 18/512K × 72)流水線的SRAM)
文件頁數(shù): 12/27頁
文件大?。?/td> 465K
代理商: CY7C1464AV25
CY7C1460AV25
CY7C1462AV25
CY7C1464AV25
Document #: 38-05354 Rev. *D
Page 12 of 27
When this scan cell, called the “extest output bus tri-state,” is
latched into the preload register during the “Update-DR” state
in the TAP controller, it will directly control the state of the
output (Q-bus) pins, when the EXTEST is entered as the
current instruction. When HIGH, it will enable the output
buffers to drive the output bus. When LOW, this bit will place
the output bus into a High-Z condition.
This bit can be set by entering the SAMPLE/PRELOAD or
EXTEST command, and then shifting the desired bit into that
cell, during the “Shift-DR” state. During “Update-DR,” the value
loaded into that shift-register cell will latch into the preload
register. When the EXTEST instruction is entered, this bit will
directly control the output Q-bus pins. Note that this bit is
preset HIGH to enable the output when the device is
powered-up, and also when the TAP controller is in the
“Test-Logic-Reset” state.
Reserved
These instructions are not implemented but are reserved for
future use. Do not use these instructions.
TAP Timing
tTL
Test Clock
(TCK)
1
2
3
4
5
6
Test Mode Select
(TMS)
tTH
Test Data-Out
(TDO)
tCYC
Test Data-In
(TDI)
tTMSH
tTMSS
tTDIH
tTDIS
tTDOX
tTDOV
DON’T CARE
UNDEFINED
TAP AC Switching Characteristics
Over the Operating Range
[9, 10]
Parameter
Clock
t
TCYC
t
TF
t
TH
t
TL
Output Times
t
TDOV
t
TDOX
Set-up Times
t
TMSS
t
TDIS
t
CS
Hold Times
t
TMSH
t
TDIH
t
CH
Description
Min.
Max.
Unit
TCK Clock Cycle Time
TCK Clock Frequency
TCK Clock HIGH time
TCK Clock LOW time
50
ns
MHz
ns
ns
20
20
20
TCK Clock LOW to TDO Valid
TCK Clock LOW to TDO Invalid
10
ns
ns
0
TMS Set-up to TCK Clock Rise
TDI Set-up to TCK Clock Rise
Capture Set-up to TCK Rise
5
5
5
ns
ns
ns
TMS Hold after TCK Clock Rise
TDI Hold after Clock Rise
Capture Hold after Clock Rise
5
5
5
ns
ns
ns
Notes:
9. t
and t
refer to the set-up and hold time requirements of latching data from the boundary scan register.
10.Test conditions are specified using the load in TAP AC test Conditions. t
R
/t
F
= 1 ns.
相關PDF資料
PDF描述
CY7C1462AV25 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL Architecture(帶NoBL結構的36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM)
CY7C1460AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL Architecture(帶NoBL結構的36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM)
CY7C1464AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL Architecture(帶NoBL結構的36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM)
CY7C1462AV33 36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL Architecture(帶NoBL結構的36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM)
CY7C1472V33-167AXI 72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined SRAM with NoBL Architecture
相關代理商/技術參數(shù)
參數(shù)描述
CY7C1464AV25-167BGC 功能描述:靜態(tài)隨機存取存儲器 512kx72 36M NoBL PL 靜態(tài)隨機存取存儲器 COM RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C1464AV25-167BGCES 制造商:Cypress Semiconductor 功能描述:36MB NOBL 512KB X 72 PIPELINE 2.5V - Bulk
CY7C1464AV25-200BGC 制造商:Cypress Semiconductor 功能描述:SRAM SYNC OCTAL 2.5V 36MBIT 512KX72 3.2NS 209FBGA - Bulk
CY7C1464AV33-167BGI 功能描述:靜態(tài)隨機存取存儲器 512Kx72 3.3V NoBL PL 靜態(tài)隨機存取存儲器 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray
CY7C146-55JC 制造商:Cypress Semiconductor 功能描述:SRAM Chip Async Dual 5V 16K-Bit 2K x 8 55ns 52-Pin PLCC 制造商:Cypress Semiconductor 功能描述:2K X 8 DUAL-PORT SRAM, 55 ns, PQCC52